BGA 2270 socket: CPUs, chipsets and cooler fit
BGA 2270 is an Intel ball grid array package for the Kaby Lake-G family, the 2018 collaboration that placed Intel CPU cores, AMD Radeon graphics and HBM2 memory on one substrate. The package carries 2,270 contacts in a 31 × 58.5 mm footprint and solders directly to the laptop or NUC mainboard. Intel lists the package as FCBGA2270 in its specification pages. The ball count follows the package name, since Intel publishes no separate ball count.
Quick facts
| Maker | Intel |
|---|---|
| Package type | BGA |
| Contacts | 2,270 |
| Package size | 31 × 58.5 mm |
| Introduced | January 2018 |
| Status | Legacy |
| Memory | DDR4-2400, two channels, up to 64 GB, plus 4 GB HBM2 on package for graphics |
| PCIe from the CPU | PCIe 3.0 with 8 user visible lanes from the package, plus an internal x8 CPU to graphics link |
| Cooler mounting holes | Not applicable (soldered) |
| Replaces | None |
| Replaced by | None |
Overview
The package arrived in January 2018 for thin performance laptops and the Hades Canyon NUC. A Kaby Lake-H quad core die with Hyper-Threading sits beside a Radeon RX Vega M die with 4 GB of HBM2, joined by an embedded bridge. GL parts run 20 compute units at 65 W package TDP, while GH parts run 24 compute units at 100 W package TDP. Every SKU also carries Intel HD Graphics 630 for setup displays and quick sync video.
Memory splits in two: DDR4-2400 in two channels up to 64 GB for the CPU, and 4 GB of HBM2 on the package with a 1024 bit bus for the graphics. PCIe shows 8 user visible version 3.0 lanes for NVMe storage, with a further x8 link reserved inside the package between the CPU and graphics. Because the whole assembly is soldered, CPU tier, graphics tier and memory size are fixed at purchase.
Processor generations
| Codename | Marketing name | Years | Notes |
|---|---|---|---|
| Kaby Lake-G | 8th Gen Core with Radeon graphics | 2018 | Multi chip packages with Kaby Lake-H CPU cores, Radeon RX Vega M GL or GH graphics and 4 GB HBM2, launched in January 2018 on BGA 2270 for performance laptops and NUCs at 65 W and 100 W package TDP. |
Who BGA 2270 serves
BGA 2270 processors belong in thin performance laptops and small form factor NUCs where discrete level graphics must fit a small board: portable play at 1080p, creator laptops with GPU acceleration and living room boxes with console like size. The 65 W GL bodies run thinner and quieter, while the 100 W GH bodies need thicker dual fan cooling for sustained clocks.
Within Kaby Lake-G the choice runs from the Core i5-8305G with 6 MB of cache for mainstream performance through the Core i7 GL parts with 8 MB to the GH parts for faster play. The vPro eligible Core i7-8706G matches the 8705G clocks for managed fleets. Buyers who only need office displays should look at cheaper U series packages instead, since they pay for graphics they will not use here.
Memory and PCIe
Memory support covers DDR4 SODIMM modules in two channels up to 64 GB at DDR4-2400 for the CPU side. The graphics side uses 4 GB of HBM2 on the package at 179.2 GB per sec on GL and 204.8 GB per sec on GH. System memory upgrades do not change graphics memory, which is fixed on the package.
PCIe arrives as version 3.0 with 8 user visible lanes for a fast NVMe SSD plus board devices. The CPU to graphics traffic stays inside the package on its own x8 link, so the visible lanes remain free for storage. ECC is not offered on these consumer mobile parts.
Identifying and servicing BGA 2270
Identification is simple in Intel documents: Sockets Supported reads FCBGA2270 and Package Size reads 31mm x 58.5mm. The long narrow footprint with two large dies plus HBM2 separates it from every other BGA package. The LGA, PGA and BGA: CPU package types explained guide explains why soldered multi chip packages cannot move between boards.
Service follows laptop and NUC practice rather than desktop practice. There is no retention bracket and no graphics card to swap, since the GPU is on the package. Repasting follows the maker manual with care around the multi die layout, and board replacement is the only path when any die fails. The How to find your CPU socket type guide shows where to find the socket line in maker specifications.
CPUs on BGA 2270
5 processor pages in the database, newest first.
| Processor | Cores / threads | Base / boost | TDP | Launched |
|---|---|---|---|---|
| Intel Core i5-8305G | 4 / 8 | 2.8 / 3.8 GHz | 65 W | Jan 2018 |
| Intel Core i7-8705G | 4 / 8 | 3.1 / 4.1 GHz | 65 W | Jan 2018 |
| Intel Core i7-8706G | 4 / 8 | 3.1 / 4.1 GHz | 65 W | Jan 2018 |
| Intel Core i7-8709G | 4 / 8 | 3.1 / 4.1 GHz | 100 W | Jan 2018 |
| Intel Core i7-8809G | 4 / 8 | 3.1 / 4.2 GHz | 100 W | Jan 2018 |
Frequently asked questions
Can a BGA 2270 processor be replaced or upgraded?
No. The processor is soldered to the board with its graphics and HBM2 beside it. Upgrading means replacing the board or the whole system, so choose the GL or GH tier at order time.
What is the difference between GL and GH parts?
GL parts carry Radeon RX Vega M GL with 20 compute units for thin performance laptops and small NUCs at 65 W package TDP. GH parts carry RX Vega M GH with 24 compute units for faster play at 100 W package TDP. Both include 4 GB of HBM2 on the package.
Does BGA 2270 use DDR4 or HBM2?
Boards use DDR4 SODIMM modules in two channels up to 64 GB at DDR4-2400. The graphics memory is separate 4 GB HBM2 on the package, so system memory size does not change graphics memory.
What PCIe does BGA 2270 provide?
PCIe 3.0 with 8 user visible lanes from the package for NVMe storage, plus an internal x8 link between the CPU and graphics dies. Exact slot wiring follows the laptop or NUC design.
Sources and verification
Facts last checked against these sources on . Page last edited on .