Intel Core i7-8809G socket: BGA 2270
The Intel Core i7-8809G uses BGA 2270 as a soldered multi chip package. It tops Kaby Lake-G with 4.2 GHz boost and GH graphics, though multiplier claims conflict between sources.
- Socket
- BGA 2270
- Launched
- January 2018
- Cores and threads
- 4 and 8
- Base power
- 100 W
- Codename
- Kaby Lake-G
- Segment
- Mobile (soldered)
- Family
- Intel Core i7
- Clocks
- 3.1 / 4.2 GHz
Intel Core i7-8809G specifications
| Cores | 4 |
|---|---|
| Threads | 8 |
| Core architecture | Kaby Lake-G (Kaby Lake-H CPU die) |
| Clocks | 3.1 GHz base, up to 4.2 GHz boost |
| Cache | 8 MB Intel Smart Cache (L3) |
| Processor base power (TDP) | 100 W (package) |
| Manufacturing process | 14 nm |
| Memory support | DDR4-2400, two channels, up to 64 GB, plus 4 GB HBM2 on package |
| PCI Express | PCIe 3.0, 8 user visible lanes from the package |
| Graphics on package | Radeon RX Vega M GH (24 CU, 1063 MHz base, up to 1190 MHz, 4 GB HBM2) |
| Integrated graphics | Intel HD Graphics 630 (350 MHz base, up to 1.10 GHz) |
| Package | FCBGA2270 (soldered, 31 by 58.5 mm) |
Motherboard compatibility
Intel Core i7-8809G needs a motherboard with a BGA 2270 socket. Chipset by chipset data for this codename is not recorded yet. See the BGA 2270 chipset list and the board maker's CPU support list.
BGA 2270 at a glance
| Type | BGA, 2,270 contacts |
|---|---|
| Package size | 31 × 58.5 mm |
| Introduced | January 2018 |
| Memory | DDR4-2400, two channels, up to 64 GB, plus 4 GB HBM2 on package for graphics |
| Cooler mounting holes | Not applicable (soldered) |
What the Core i7-8809G is
The Core i7-8809G is a four core, eight thread mobile processor with a 3.1 GHz base and up to 4.2 GHz boost. It carries 8 MB of Smart Cache and a 100 W package TDP on the 14 nm process. Intel announced it in January 2018 as the top Kaby Lake-G SKU with the highest boost in the family.
The package joins a Kaby Lake-H quad core with a Radeon RX Vega M GH die of 24 compute units and 4 GB of HBM2. The GH graphics run 1063 MHz base to 1190 MHz max with 204.8 GB per sec of HBM2 bandwidth. Four cores with Hyper-Threading cover play beside creation at 1080p and beyond.
Tuning claims need care on this SKU. Intel ARK, the database and WikiChip all list the multiplier as locked, while Intel marketing and several reviews describe the 8809G as overclockable with independent CPU, GPU and HBM tuning in unlocked NUCs. With sources split, this page omits the multiplier row and buyers should confirm tuning support in the exact system BIOS.
Intel HD Graphics 630 from 350 MHz to 1.10 GHz covers setup displays beside the Radeon die. Memory for the CPU side runs as DDR4-2400 in two channels up to 64 GB.
Socket and motherboard compatibility
The 8809G is soldered to the board in the BGA 2270 package and cannot be replaced. Upgrading means replacing the board or the whole system. It shipped in flagship thin laptops and the Hades Canyon NUC, where the maker BIOS decides how much tuning is actually exposed.
Intel ARK lists Sockets Supported as FCBGA2270 with a 31 by 58.5 mm package. Boards pair the 100 W GH package with strong dual fan cooling. The CPU to graphics traffic stays inside the package, leaving 8 PCIe 3.0 lanes visible for NVMe storage.
There is no socket retention and no graphics card to swap. The Intel Core i7-8709G is the locked GH sibling on the same package with 100 MHz less boost for buyers who do not need tuning debates.
Memory, PCIe and cooling
Memory support covers DDR4-2400 SODIMM modules in two channels up to 64 GB for the CPU side. The graphics side uses 4 GB of HBM2 on the package. ECC is not supported. Two matched sticks give dual channel speed for play and creation.
PCI Express shows 8 user visible version 3.0 lanes for a fast NVMe SSD plus board devices. Cooling follows the 100 W package rating, so makers tune fan curves for sustained graphics loads. Heat quickly becomes the tuning limit in thin bodies.
Upgrade paths
There is no CPU or GPU upgrade path on BGA 2270. The only moves are more DDR4 where SODIMM slots allow it, a larger SSD, or a whole system replacement. The 8809G already tops the package stack, so the next step is a full discrete GPU system.
Staying on this board, dual channel DDR4 and updated Radeon drivers help more than chasing clocks. Confirm tuning support in the exact BIOS before paying extra for the top bin.
Frequently asked questions
What socket does the Core i7-8809G use?
It uses BGA 2270 as a soldered multi chip package with CPU, Radeon graphics and HBM2. Nothing on the package can be replaced.
How many cores does the 8809G have?
Four cores with Hyper-Threading give eight threads at 3.1 GHz base with up to 4.2 GHz boost, with 8 MB of cache at 100 W package TDP.
Is the 8809G unlocked?
Sources split: ARK, the database and WikiChip list locked, while Intel marketing and reviews describe it as overclockable. Confirm tuning in the exact system BIOS.
Which graphics does the 8809G include?
Radeon RX Vega M GH with 24 compute units to 1190 MHz and 4 GB of HBM2, plus Intel HD 630 for setup displays.
How does the 8809G differ from the 8709G?
The 8809G adds 100 MHz boost over the 8709G on the same GH package. Both need 100 W cooling and soldered boards.
Sources and verification
Facts last checked against these sources on . Page last edited on .