BGA 1515 Socket: Compatible CPUs, Chipsets and Coolers

Maker	Intel
Package type	BGA
Contacts	1,515
Package size	20 × 16.5 mm
Introduced	September 2015
Status	Legacy
Memory	LPDDR3-1866 and DDR3L-1600, two channels, up to 16 GB
PCIe from the CPU	PCIe 3.0, up to 10 lanes
Cooler mounting holes	Not applicable (soldered)
Replaces	None
Replaced by	None

Overview

The package exists for thin devices without fans. Two Skylake cores with four threads cover web work and office apps at 900 MHz to 1.2 GHz base with turbo to 2.2 GHz to 3.1 GHz. Four megabytes of Smart Cache sit beside HD Graphics 515 at 300 MHz base with peaks from 850 MHz to 1000 MHz. Memory stays low power with LPDDR3-1866 and DDR3L-1600 over two channels to 16 GB. PCIe arrives as 3.0 with up to 10 lanes for SSDs and board I/O.

Because the die solders to the board there is no board choice and no processor swap. Device makers tune the thermal path for silent operation at 4.5 W. Buyers pick core m3, m5 or m7 once, with storage as the only part that sometimes changes later.

Codename	Marketing name	Years	Notes
Skylake-Y	6th Gen Core m	2015	Fanless 4.5 W dual core parts with HD Graphics 515, launched in September 2015 for tablets and 2 in 1 devices.

Who BGA 1515 serves

BGA 1515 fits fanless tablets, detachables and thin 2 in 1 devices where silence and battery life decide the design. The 4.5 W envelope with 3.5 W to 3.8 W idle points suits sealed bodies without vents. Makers pair it with small SSDs and high efficiency displays.

Within the family the choice runs from the Core m3-6Y30 for web and office through the Core m5-6Y54 and m5-6Y57 for heavier multitasking to the Core m7-6Y75 for burst work at 3.1 GHz. Graphics stay HD Graphics 515 across the stack, so display support does not separate the SKUs. Pick by base clock and turbo headroom rather than by core count, since all four parts use two cores with four threads.

Memory and PCIe

Memory support covers LPDDR3-1866 and DDR3L-1600 over two channels to 16 GB with up to 29.8 GB/s of bandwidth. Soldered LPDDR3 dominates tablets for power reasons, while some 2 in 1 boards use DDR3L modules. ECC is not offered on these consumer mobile parts. Capacity planning matters because memory rarely changes after purchase.

PCIe 3.0 with up to 10 lanes feeds storage and board devices in splits of 1x4, 2x2, 1x2 plus 2x1 and 4x1. Most designs wire four lanes to an NVMe or SATA SSD with the rest for Wi-Fi and sensors. A Gen3 SSD matches the lane budget without waste, which keeps power and cost in line with the fanless brief.

Processor	Cores / threads	Base / boost	TDP	Launched
Intel Core m3-6Y30	2 / 4	0.9 / 2.2 GHz	4.5 W	Sep 2015
Intel Core m5-6Y54	2 / 4	1.1 / 2.7 GHz	4.5 W	Sep 2015
Intel Core m5-6Y57	2 / 4	1.1 / 2.8 GHz	4.5 W	Sep 2015
Intel Core m7-6Y75	2 / 4	1.2 / 3.1 GHz	4.5 W	Sep 2015

Frequently asked questions

Can a BGA 1515 processor be replaced or upgraded?

No. The chip solders to the board with 1,515 balls. A faster tablet or 2 in 1 means a new board or a new device. Memory and storage choices also lock at order time on most designs.

What memory does BGA 1515 use?

LPDDR3-1866 and DDR3L-1600 over two channels to 16 GB. Dual channel fitting feeds both the cores and the HD Graphics 515 unit, so makers usually solder matched pairs for bandwidth.

Does BGA 1515 support PCIe 3.0?

Yes. The CPUs expose PCIe 3.0 with up to 10 lanes for SSDs and board devices. Wiring depends on the tablet or 2 in 1 design, with common splits of 1x4, 2x2 and 4x1.

What is the difference between BGA 1515 and BGA 1516?

BGA 1515 at 20 × 16.5 mm carries 4.5 W Skylake-Y Core m parts with HD Graphics 515 from September 2015. BGA 1516 at a larger footprint carries later low power Core parts at higher TDP with newer graphics.

BGA 1515 socket: CPUs, chipsets and cooler fit

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