Intel Core m3-6Y30 socket: BGA 1515
The Intel Core m3-6Y30 uses the BGA 1515 package, a 20 × 16.5 mm grid that solders to the tablet board. It is a dual core Skylake-Y part at 4.5 W with HD Graphics 515, and the soldered chip cannot be replaced.
- Socket
- BGA 1515
- Launched
- September 2015
- Cores and threads
- 2 and 4
- Base power
- 4.5 W
- Codename
- Skylake-Y
- Segment
- Mobile (soldered)
- Family
- Intel Core m3
- Clocks
- 0.9 / 2.2 GHz
Intel Core m3-6Y30 specifications
| Cores | 2 |
|---|---|
| Threads | 4 |
| Core architecture | Skylake cores on 14 nm |
| Clocks | 900 MHz base, up to 2.2 GHz turbo |
| Cache | 4 MB Intel Smart Cache |
| Processor base power (TDP) | 4.5 W (7 W configurable up, 3.8 W down) |
| Manufacturing process | 14 nm |
| Memory support | LPDDR3-1866 and DDR3L-1600, two channels, up to 16 GB |
| PCI Express | PCIe 3.0, up to 10 lanes |
| Integrated graphics | Intel HD Graphics 515 (300 MHz to 850 MHz) |
| ECC memory | No |
| Package | FCBGA1515 (20 × 16.5 mm, soldered) |
Motherboard compatibility
Intel Core m3-6Y30 needs a motherboard with a BGA 1515 socket. Chipset by chipset data for this codename is not recorded yet. See the BGA 1515 chipset list and the board maker's CPU support list.
BGA 1515 at a glance
| Type | BGA, 1,515 contacts |
|---|---|
| Package size | 20 × 16.5 mm |
| Introduced | September 2015 |
| Memory | LPDDR3-1866 and DDR3L-1600, two channels, up to 16 GB |
| Cooler mounting holes | Not applicable (soldered) |
What the Core m3-6Y30 is
The Core m3-6Y30 opens the Skylake-Y Core m line for fanless tablets on BGA 1515. Intel released it in September 2015 with two cores and four threads at 900 MHz base and 2.2 GHz turbo. Four megabytes of Smart Cache cover web and office work. Processor base power is 4.5 W with bursts to 7 W and idle points down to 3.8 W.
The low base clock suits sealed bodies without vents. Turbo lifts foreground tabs and apps, while sustained loads settle low to protect skin temperatures. Hyper-Threading keeps four threads for multitasking. The multiplier is locked.
HD Graphics 515 from 300 MHz to 850 MHz drives tablet displays with 4K output at 60 Hz over DisplayPort. The 14 nm process holds battery life for thin designs. Buyers pick the m3 where cost and efficiency matter more than burst speed. It trails m5 parts by 500 MHz turbo, which shows in heavy tabs.
Socket and motherboard compatibility
The m3-6Y30 fits the BGA 1515 soldered package at 20 × 16.5 mm with 1,515 contacts. Device makers solder it directly with passive cooling tuned for 4.5 W. There is no socketed market and no processor upgrade, so buyers choose the configuration once at order time.
Board memory is LPDDR3-1866 or DDR3L-1600 over two channels to 16 GB. Soldered LPDDR3 dominates tablets for power and thickness. Makers that keep DDR3L slots allow later memory changes on some 2 in 1 designs. The LGA, PGA and BGA: CPU package types explained guide explains why soldered mobile designs skip the desktop swap path.
Memory, PCIe and cooling
LPDDR3-1866 and DDR3L-1600 support arrives over two channels to 16 GB with up to 29.8 GB/s of bandwidth. Dual channel fitting feeds both cores and the HD 515 graphics, so matched soldered pairs decide smoothness. Eight gigabytes covers tablet multitasking with margin. ECC is not offered.
PCIe 3.0 with up to 10 lanes covers SSDs and board devices in splits of 1x4, 2x2 and 4x1. Most tablets wire four lanes to storage with the rest for Wi-Fi and sensors. A Gen3 SSD matches the lane budget without excess power.
Cooling belongs to the device maker across the 3.8 W to 7 W band with spreaders and chassis dissipation. No cooler ships with the soldered processor. Sustained clocks under long installs track body temperature more than headline turbo.
Upgrade paths
No CPU upgrade exists on a soldered BGA-1515 board. The buying ladder inside Skylake-Y runs from this m3-6Y30 through the Intel Core m5-6Y54 at 1.1 GHz to 2.7 GHz to the Intel Core m7-6Y75 at 1.2 GHz to 3.1 GHz, chosen at order time. Storage is the only part that sometimes changes afterward.
A move beyond Skylake-Y means replacing the whole tablet on a newer platform such as Kaby Lake-Y. The How to find your CPU socket type guide helps identify soldered designs before purchase.
Frequently asked questions
What socket does the Core m3-6Y30 use?
It uses BGA 1515, a soldered 20 × 16.5 mm package. The chip cannot be replaced.
How many cores does the Core m3-6Y30 have?
Two cores with four threads at 900 MHz base and turbo to 2.2 GHz with 4 MB of cache.
Which graphics does the Core m3-6Y30 include?
Intel HD Graphics 515 from 300 MHz to 850 MHz.
What is the TDP of the Core m3-6Y30?
4.5 W base with 7 W bursts and 3.8 W idle points for fanless tablets.
What memory does the Core m3-6Y30 support?
LPDDR3-1866 and DDR3L-1600 over two channels to 16 GB.
Sources and verification
- Intel Core m3-6Y30 Processor specifications (Intel)
- Intel Core M Mobile Processor Comparison Chart (Intel)
Facts last checked against these sources on . Page last edited on .