BGA 1466 socket: CPUs, chipsets and cooler fit
BGA 1466 is Intel soldered ball grid array package for the Atom E600C Stellarton embedded family. It carries 1,466 balls in the FC-BGA package for Bonnell single core SoCs with Hyper-Threading. Intel lists the E625CT covered here with FC-BGA 1466 as the supported socket and November 22, 2010 as the launch date at 2.7 W.
Quick facts
| Maker | Intel |
|---|---|
| Package type | BGA |
| Contacts | 1,466 |
| Package size | n/a |
| Introduced | November 2010 |
| Status | Legacy |
| Memory | DDR2 single channel up to DDR2-800, up to 2 GB |
| PCIe from the CPU | PCIe 1.0a x4 lanes from the CPU |
| Cooler mounting holes | Not applicable (soldered) |
| Replaces | BGA 676 |
| Replaced by | None |
Overview
The package pairs a 600 MHz Bonnell core with two threads, 512 KB of L2 cache, GMA600 graphics at 320 MHz and a small I/O complement: single-channel DDR2 up to DDR2-800 and 4 lanes of PCIe 1.0a. That balance suits fanless gateways, kiosks, HMIs and in-vehicle terminals where a few watts matter more than peak throughput. CT parts cover minus 40 to 85 C for outdoor and cabinet builds, while C parts cover 0 to 70 C.
Like every soldered Intel BGA package, BGA 1466 trades replacement for integration. The chip cannot be swapped, cooling is part of the board design for the configured TDP, and Intel backs the embedded SKUs with embedded lifecycle supply. When a design needs more cores or DDR3 memory than Stellarton allows, a larger embedded platform from the later Atom range carries the load instead.
Processor generations
| Codename | Marketing name | Years | Notes |
|---|---|---|---|
| Stellarton | Atom E600C series | 2010 | Bonnell single core SoCs with Hyper-Threading, 512 KB of L2 cache, GMA600 graphics and DDR2 controller, including 600 MHz E625C and E625CT at 2.7 W from November 2010 with commercial and industrial ratings. |
A soldered package for small boards
BGA 1466 follows the same rule as every BGA package on this site: the processor is soldered once at the factory and stays with the board for life. There are no pins to bend and no lever to lift, but there is also no CPU upgrade path. An embedded designer qualifies one SKU for the whole production run, and a buyer lives with the chosen clock and temperature range. Intel marks the E600C parts as embedded with tray supply.
The package choice shapes the board more than buyers expect. The FC-BGA 1466 footprint needs its own layout, and the single-channel DDR2 decision with up to 2 GB is fixed per board. Compatibility still depends on firmware, so a board revision needs a BIOS that knows the Stellarton stepping and the GMA600 display path.
Memory, expansion and cooling
Memory on BGA 1466 is a board decision with one valid answer. Designs solder DDR2-800 in single channel up to 2 GB, which keeps power and cost low for single core workloads. ECC is not part of these SKUs, so designs that need error correction step up to a larger embedded platform.
Expansion comes from 4 lanes of PCIe 1.0a plus USB, LVDS and serial DVO display outputs with HD audio on the SoC. The lanes usually split between boot storage and wired networking, with the exact split fixed per board. Boards that need more than the SoC offers cannot add a discrete chipset lane budget, so the block diagram of the exact board decides real expansion.
Cooling has no retail answer on BGA 1466. The same package spans the 2.7 W E625CT and faster parts to 7 W, and the heatsink or spreader is drawn for the configured TDP of that product. The industrial CT rating to 85 C suits sealed cabinets with careful airflow, and mounting pressure follows the board maker specification rather than a cooler maker socket list.
CPUs on BGA 1466
6 processor pages in the database, newest first.
| Processor | Cores / threads | Base / boost | TDP | Launched |
|---|---|---|---|---|
| Intel Atom E625C | 1 / 2 | 0.6 GHz | 2.7 W | Nov 2010 |
| Intel Atom E625CT | 1 / 2 | 0.6 GHz | 2.7 W | Nov 2010 |
| Intel Atom E645C | 1 / 2 | 1.0 GHz | 3.6 W | Nov 2010 |
| Intel Atom E645CT | 1 / 2 | 1.0 GHz | 3.6 W | Nov 2010 |
| Intel Atom E665C | 1 / 2 | 1.3 GHz | 3.6 W | Nov 2010 |
| Intel Atom E665CT | 1 / 2 | 1.3 GHz | 3.6 W | Nov 2010 |
Frequently asked questions
Can a BGA 1466 processor be replaced or upgraded?
No. The processor is soldered to the board in the FC-BGA 1466 package. Upgrading means replacing the board or module, so choose clock and temperature range at design time.
Which processors fit BGA 1466?
Atom E600C Stellarton parts, including the 600 MHz E625CT at 2.7 W covered here with industrial temperature range. Commercial E625C, E645C and E665C share the package with 0 to 70 C rating, while CT parts cover minus 40 to 85 C.
What memory does BGA 1466 use?
DDR2 single channel up to DDR2-800 with up to 2 GB. The board design fixes the memory, so check the vendor list before committing.
Does BGA 1466 support PCIe Gen 3 or Gen 4?
PCIe 1.0a with 4 lanes from the CPU. That lane budget suits boot storage, wired networking and display bridges on small embedded boards rather than large arrays.
Sources and verification
Facts last checked against these sources on . Page last edited on .