BGA 1356 socket: CPUs, chipsets and cooler fit
BGA 1356 is an Intel ball grid array package for thin laptop processors of the Skylake-U, Kaby Lake-U and Kaby Lake-R families. The package carries 1,356 contacts in a 42 × 24 mm footprint and solders directly to the laptop mainboard. Intel lists the package as FCBGA1356 in its specification pages. The ball count follows the package name with community documentation as corroboration, since Intel publishes no separate ball count.
Quick facts
| Maker | Intel |
|---|---|
| Package type | BGA |
| Contacts | 1,356 |
| Package size | 42 × 24 mm |
| Introduced | September 2015 |
| Status | Legacy |
| Memory | DDR4-2400 and LPDDR3-2133, two channels, up to 32 GB |
| PCIe from the CPU | PCIe 3.0 from the CPU for storage and board devices, 12 lanes on dual core parts |
| Cooler mounting holes | Not applicable (soldered) |
| Replaces | None |
| Replaced by | None |
Overview
The package arrived with Skylake-U in 2015 for 15 W thin laptops, then carried Kaby Lake-U in 2016 and the Kaby Lake-R quad cores from August 2017. Core counts span 2 cores on parts like the Core i3-8130U to 4 cores with Hyper-Threading on the Core i5 and i7 R parts. Every SKU pairs its cores with Intel UHD or HD Graphics for display output, so laptops can run without a discrete GPU for office work.
Memory stays DDR4 or LPDDR3 across the generations, with two channels and up to 32 GB on Kaby Lake-R boards. PCIe runs at version 3.0 with up to 12 lanes from the CPU on dual core parts. Because the chip is soldered, core count, graphics tier and memory size are fixed at purchase. Do not confuse this BGA package with LGA 1356, the 2012 server socket of the same number, which is a different socket entirely.
Processor generations
| Codename | Marketing name | Years | Notes |
|---|---|---|---|
| Skylake-U | 6th Gen Core U | 2015 to 2016 | Thin laptop processors on the 42 by 24 mm BGA 1356 package, launched in 2015 with DDR4 and DDR3L support on early boards. |
| Kaby Lake-U | 7th Gen Core U | 2016 to 2017 | Thin laptop processors on BGA 1356 with higher clocks than Skylake-U and DDR4-2133 support, launched in 2016. |
| Kaby Lake-R | 8th Gen Core U quad cores | 2017 to 2018 | Thin laptop processors with up to 4 cores and 8 threads on BGA 1356, launched in August 2017 with DDR4-2400, plus the late dual core Core i3-8130U in February 2018. |
Who BGA 1356 serves
BGA 1356 processors belong in 13 and 14 inch thin laptops where battery life and weight matter: office ultrabooks, student laptops and business travelers with single fan cooling. The 15 W base with a 10 W down configuration lets makers tune the same silicon for fanless-feeling quiet bodies or slightly thicker performance bodies.
Within Kaby Lake-R the choice runs from the 2-core Core i3-8130U for basic office work to 4-core Core i5 and i7 parts for mixed work with heavier multitasking. Graphics stay Intel UHD 620 across the range, so buyers who play with heavy 3D should plan on a discrete GPU or a later G series package with on package graphics. Office buyers can rely on the integrated GPU for dual display output.
Memory and PCIe
Memory support covers DDR4 SODIMM modules on most boards plus soldered LPDDR3 variants on thin designs. Kaby Lake-R reaches DDR4-2400 with up to 32 GB across two channels. Bandwidth peaks near 37.5 GB per sec with matched modules. ECC is not offered on these consumer mobile parts.
PCIe arrives as version 3.0 with up to 12 lanes from the CPU on dual core parts, wired for NVMe storage and board devices. Laptop designs typically give x4 to a fast SSD. There is no Thunderbolt requirement on these designs, so external graphics depend on the maker implementation rather than the package.
Identifying and servicing BGA 1356
Identification is simple in Intel documents: Sockets Supported reads FCBGA1356 and Package Size reads 42mm x 24mm. That line separates BGA 1356 from BGA 1528 thin laptop parts at 46 by 24 mm and from BGA 1440 performance parts at 42 by 28 mm. The LGA, PGA and BGA: CPU package types explained guide explains why soldered packages cannot move between boards.
Service follows laptop practice rather than desktop practice. There is no retention bracket and no aftermarket mounting pattern to match. Repasting and fan cleaning follow the laptop maker manual, and board replacement is the only path when the processor fails. The How to find your CPU socket type guide shows where to find the socket line in maker specifications.
CPUs on BGA 1356
7 processor pages in the database, newest first.
| Processor | Cores / threads | Base / boost | TDP | Launched |
|---|---|---|---|---|
| Intel Core i3-8130U | 2 / 4 | 2.2 / 3.4 GHz | 15 W | Feb 2018 |
| Intel Core i5-8250U | 4 / 8 | 1.6 / 3.4 GHz | 15 W | Aug 2017 |
| Intel Core i5-8350U | 4 / 8 | 1.7 / 3.6 GHz | 15 W | Aug 2017 |
| Intel Core i7-8550U | 4 / 8 | 1.8 / 4.0 GHz | 15 W | Aug 2017 |
| Intel Core i7-8650U | 4 / 8 | 1.9 / 4.2 GHz | 15 W | Aug 2017 |
| Intel Celeron 3865U | 2 / 2 | 1.8 / 1.8 GHz | 15 W | Jan 2017 |
| Intel Celeron 3965U | 2 / 2 | 2.2 / 2.2 GHz | 15 W | Jan 2017 |
Frequently asked questions
Can a BGA 1356 processor be replaced or upgraded?
No. The processor is soldered to the board. Upgrading means replacing the board or the whole laptop, so choose memory size at order time.
What is the difference between BGA 1356 and BGA 1528?
BGA 1356 at 42 × 24 mm serves 15 W U series laptops from Skylake through Kaby Lake-R. BGA 1528 at 46 × 24 mm serves later Whiskey Lake-U and Comet Lake-U laptops. The two packages do not interchange.
Does BGA 1356 use DDR4 or LPDDR?
Boards use DDR4 SODIMM modules or soldered LPDDR3, depending on the design. Kaby Lake-R tops out at DDR4-2400 with LPDDR3-2133. Two channels carry up to 32 GB on parts like the Core i3-8130U.
What PCIe does BGA 1356 provide?
PCIe 3.0 from the CPU for NVMe storage and board devices, with 12 lanes on the Core i3-8130U. Exact slot wiring follows the laptop design, so check the maker specifications for SSD speed.
Sources and verification
Facts last checked against these sources on . Page last edited on .