VIA Nano QuadCore C4700 socket: VIA NanoBGA2
The VIA Nano QuadCore C4700 uses the VIA NanoBGA2 package soldered to embedded boards. It is a 4 core ZX-C part from 1.333 GHz to 2.0 GHz at 18 W with no on die graphics.
- Socket
- VIA NanoBGA2
- Launched
- January 2015
- Cores and threads
- 4 and 4
- Base power
- 18 W
- Codename
- ZX-C
- Segment
- Embedded
- Family
- VIA Nano QuadCore
- Clocks
- 1.33 / 2.0 GHz
VIA Nano QuadCore C4700 specifications
| Cores | 4 |
|---|---|
| Threads | 4 |
| Core architecture | Isaiah II cores on 28 nm (TSMC) |
| Clocks | 1.333 GHz base, up to 2.0 GHz turbo |
| Cache | 2 MB shared L2 cache |
| Processor base power (TDP) | 18 W |
| Manufacturing process | 28 nm |
| Memory support | DDR3-1333, single channel |
| Front side bus | 1333 MHz VIA V4 bus |
| Integrated graphics | None (chipset feature on some boards) |
| Multiplier | Locked |
| ECC memory | No |
| Package | VIA nanoBGA2 (21 × 21 mm, soldered) |
Motherboard compatibility
VIA Nano QuadCore C4700 needs a motherboard with a VIA NanoBGA2 socket. Chipset by chipset data for this codename is not recorded yet. See the VIA NanoBGA2 chipset list and the board maker's CPU support list.
VIA NanoBGA2 at a glance
| Type | BGA, 400 contacts |
|---|---|
| Package size | 21.0 × 21.0 mm |
| Introduced | May 2008 |
| Memory | DDR2 through the board chipset |
| Cooler mounting holes | Not applicable (soldered) |
What the Nano QuadCore C4700 is
The Nano QuadCore C4700 is the early 2015 VIA embedded quad on VIA NanoBGA2 for fanless controllers. It runs 4 cores and 4 threads at 1.333 GHz base with bursts to 2.0 GHz. Two megabytes of shared L2 cover control tasks. Power is 18 W on 28 nm from January 2015. The ZX-C codename marks this cut of Isaiah II silicon.
The same clocks and power as the later C4650 make the two interchangeable in practice. PadLock AES and hashing accelerate security workloads without extra chips. The 46 mm2 TSMC die sips power in sealed enclosures. The locked multiplier keeps long life behavior stable.
Single channel DDR3-1333 feeds the cores. Display output where needed comes from the companion chipset. Buyers pick the C4700 where early 2015 VIA supply fits the lifecycle plan.
Socket and motherboard compatibility
The C4700 solders to VIA NanoBGA2 with 400 balls at 21 × 21 mm. No upgrade path exists after soldering. The socket chipset table covers this ZX-C codename with VX900 and VX11 companions.
Memory is single channel DDR3 by platform design. The LGA, PGA and BGA: CPU package types explained guide covers soldered embedded limits. Validate the exact companion chipset for display needs.
Memory, PCIe and cooling
DDR3-1333 over one channel with about 10.7 GB/s feeds four cores. One memory channel is the whole system, so size it once. ECC is absent.
The 1333 MHz bus to the chipset carries board I/O including PCIe and display. Small SSDs suit logging workloads. Lane counts follow the board manual.
Cooling is a low profile heatsink for 18 W. Fanless cabinets suit the locked clocks. Stable thermals protect decade long deployments.
Upgrade paths
No soldered upgrade exists. The VIA Nano QuadCore C4650 from September 2015 matches it on clocks and power as the lateral alternative. Both share nanoBGA2 boards.
A new embedded platform means a new board. The How to find your CPU socket type guide helps spot soldered VIA systems.
Frequently asked questions
What socket does the VIA Nano QuadCore C4700 use?
It uses VIA NanoBGA2, soldered.
How many cores does the Nano QuadCore C4700 have?
4 cores and 4 threads at 1.333 GHz base with bursts to 2.0 GHz.
When did the Nano QuadCore C4700 launch?
January 2015.
What is the TDP of the Nano QuadCore C4700?
18 W.
Sources and verification
Facts last checked against these sources on . Page last edited on .