Loongson 3A6000 socket: BGA-1190
The Loongson 3A6000 uses the BGA-1190 package. It is a soldered 38 W quad-core LoongArch desktop and server part at up to 2.5 GHz with LA664 cores and it cannot be replaced.
- Socket
- BGA-1190
- Launched
- November 1, 2023
- Cores and threads
- 4 and 8
- Base power
- 38 W
- Codename
- LA664
- Segment
- Desktop
- Family
- Loongson 3A
- Clocks
- 2.0 / 2.5 GHz
Loongson 3A6000 specifications
| Cores | 4 |
|---|---|
| Threads | 8 |
| Core architecture | LA664 (LoongArch) |
| Clocks | 2000 MHz base, up to 2500 MHz |
| Cache | 128 KB L1 per core, 256 KB L2 per core, 16 MB shared L3 |
| Default TDP | 38 W |
| Manufacturing process | 12 nm |
| Memory support | Dual DDR4-3200 with ECC through the on-chip controllers |
| Front side bus | HyperTransport 3.0 links to the companion bridge |
| Package | BGA-1190 (soldered BGA, 1190 balls, 35 × 35 mm) |
| Multiplier | Locked |
| Integrated graphics | None |
Motherboard compatibility
Loongson 3A6000 needs a motherboard with a BGA-1190 socket. Chipset by chipset data for this codename is not recorded yet. See the BGA-1190 chipset list and the board maker's CPU support list.
BGA-1190 at a glance
| Type | BGA, 1,190 contacts |
|---|---|
| Package size | 35 × 35 mm |
| Introduced | July 2021 |
| Memory | DDR4 with ECC through the on-chip controllers |
| Cooler mounting holes | Not applicable (soldered) |
What the 3A6000 is
The Loongson 3A6000 is a quad-core soldered general-purpose processor from November 2023. It runs four LA664 LoongArch cores at 2.0 GHz to 2.5 GHz with eight threads, so 4 cores give 8 threads. Cache is 16 MB of shared L3 with 256 KB of private L2 per core on a 12 nm process. Power is rated at 38 W typical at 2.5 GHz in a 35 mm by 35 mm BGA package with 1190 balls.
A new LA664 microarchitecture with 6-issue out-of-order execution lifts integer IPC near Zen 4 levels at equal clocks, which is why the 3A6000 at 2.5 GHz roughly doubles 3A5000 throughput. Loongson debuted the 3A6000 in November 2023. The chip supports 128 and 256-bit vector instructions with binary translation.
Higher IPC with eight threads suits desktops and servers with DDR4 ECC memory. The 38 W envelope stays close to the predecessor. That is why the 3A6000 shipped as the domestic performance pick.
Socket and motherboard compatibility
The 3A6000 is soldered to BGA-1190 boards and cannot be replaced. It fits LoongArch boards with BGA-1190 solder lands and firmware that lists the 3A6000. The Socket vs chipset: what decides whether a CPU works guide covers pairing rules.
Domestic performance desktops and servers are the natural match. Boards built for the 3A6000 carry the soldered chip with a board heatsink for the 38 W class.
Memory, PCIe and cooling
Memory is dual DDR4-3200 with ECC through the on-chip controllers. HyperTransport 3.0 links the companion bridge for PCIe expansion. Thermal design is board-level with a heatsink for the 38 W class.
Upgrade paths
There is no CPU upgrade path from a soldered 3A6000. The chip cannot move to a faster part. A board or system replacement is the only move.
For planning, a 3A5000 is the LA464 predecessor on the same lands. The BGA-1190 page lists the range.
Frequently asked questions
What socket does the 3A6000 use?
BGA-1190 as a soldered 1190-ball package. It is a 38 W quad-core LoongArch part and it cannot be replaced.
Can the 3A6000 be replaced?
No. The balls are soldered to the board.
What memory does the 3A6000 use?
Dual DDR4-3200 with ECC through the on-chip controllers.
What is the upgrade path from the 3A6000?
There is none at the CPU level.
Sources and verification
- Loongson 3A6000 specs LA664 BGA 1190 pins (Loongson)
- Loongson 3A6000 IPC Zen 4 class (Notebookcheck)
- Loongson specs table 3A6000 (Wikipedia)
Facts last checked against these sources on . Page last edited on .