Loongson 3A5000 socket: BGA-1190
The Loongson 3A5000 uses the BGA-1190 package. It is a soldered 35 W quad-core LoongArch desktop and server part at up to 2.5 GHz and it cannot be replaced.
- Socket
- BGA-1190
- Launched
- July 1, 2021
- Cores and threads
- 4 and 4
- Base power
- 35 W
- Codename
- LA464
- Segment
- Desktop
- Family
- Loongson 3A
- Clocks
- 2.3 / 2.5 GHz
Loongson 3A5000 specifications
| Cores | 4 |
|---|---|
| Threads | 4 |
| Core architecture | LA464 (LoongArch) |
| Clocks | 2300 MHz base, up to 2500 MHz |
| Cache | 128 KB L1 per core, 256 KB L2 per core, 16 MB shared L3 |
| Default TDP | 35 W |
| Manufacturing process | 12 nm |
| Memory support | Dual DDR4-3200 with ECC through the on-chip controllers |
| Front side bus | HyperTransport 3.0 links to the companion bridge |
| Package | BGA-1190 (soldered BGA, 1190 balls, 35 × 35 mm) |
| Multiplier | Locked |
| Integrated graphics | None |
Motherboard compatibility
Loongson 3A5000 needs a motherboard with a BGA-1190 socket. Chipset by chipset data for this codename is not recorded yet. See the BGA-1190 chipset list and the board maker's CPU support list.
BGA-1190 at a glance
| Type | BGA, 1,190 contacts |
|---|---|
| Package size | 35 × 35 mm |
| Introduced | July 2021 |
| Memory | DDR4 with ECC through the on-chip controllers |
| Cooler mounting holes | Not applicable (soldered) |
What the 3A5000 is
The Loongson 3A5000 is a quad-core soldered general-purpose processor from 2021. It runs four LA464 LoongArch cores at 2.3 GHz to 2.5 GHz with no turbo beyond the top bin, so 4 cores give 4 threads. Cache is 16 MB of shared L3 with 256 KB of private L2 and 128 KB of L1 per core on a 12 nm process. Power is rated at 35 W typical at 2.5 GHz in a 35 mm by 35 mm BGA package with 1190 balls.
Binary translation for x86 and Arm software with LoongArch compilers in GCC, LLVM, Go and Rust gives the 3A5000 a working ecosystem outside English-language markets, which is why it suits Chinese-market desktops and servers. Loongson launched the 3A5000 in July 2021 with pin compatibility to the 3A4000. The chip supports 128 and 256-bit vector instructions with dynamic voltage and frequency scaling.
A 4-core layout with ECC memory and HyperTransport links suits desktops, servers, gateways and industrial boxes with soldered layouts. The 35 W envelope keeps board cooling modest. That is why the 3A5000 shipped in domestic PCs and servers.
Socket and motherboard compatibility
The 3A5000 is soldered to BGA-1190 boards and cannot be replaced. It fits LoongArch boards with BGA-1190 solder lands and firmware that lists the 3A5000. The Socket vs chipset: what decides whether a CPU works guide covers pairing rules.
Domestic desktops and servers are the natural match. Boards built for the 3A5000 carry the soldered chip with a board heatsink for the 35 W class.
Memory, PCIe and cooling
Memory is dual DDR4-3200 with ECC through the two on-chip 72-bit controllers. HyperTransport 3.0 controllers link the companion bridge for PCIe expansion. Thermal design is board-level with a heatsink for the 35 W class.
Upgrade paths
There is no CPU upgrade path from a soldered 3A5000. The chip cannot move to a faster part. A board or system replacement is the only move.
For planning, a 3A6000 such as Loongson 3A6000 is the LA664 successor at up to 2.5 GHz with higher IPC on the same BGA-1190 lands when the board lists it. The BGA-1190 page lists the LoongArch range.
Frequently asked questions
What socket does the 3A5000 use?
BGA-1190 as a soldered 1190-ball package. It is a 35 W quad-core LoongArch part at up to 2.5 GHz and it cannot be replaced.
Can the 3A5000 be replaced?
No. The balls are soldered to the board.
What memory does the 3A5000 use?
Dual DDR4-3200 with ECC through the on-chip controllers.
What is the upgrade path from the 3A5000?
There is none at the CPU level. A 3A6000 board is the successor path.
Sources and verification
- Loongson 3A5000 specs LA464 BGA (Loongson)
- Loongson 3A5000 benchmarks LoongArch (OpenBenchmarking)
- Loongson specs table 3A5000 (Wikipedia)
Facts last checked against these sources on . Page last edited on .