Intel Xeon Platinum 8593Q socket: LGA 4677

What the Xeon Platinum 8593Q is

Intel positions the Xeon Platinum 8593Q as the 64-core member of the 5th Gen Xeon Scalable family for LGA 4677 boards from December 2023. 64 cores with hyperthreading give 64 cores and 128 threads, with base at 2.2 GHz and up to 3.9 GHz turbo. The package carries 320 MB of Smart Cache. The 385 W envelope is the highest in the Emerald Rapids batch and needs a high capacity heatsink with front to back airflow and a chassis rated for continuous full load. The 385 W envelope with a 60 °C Tcase ceiling leaves little thermal headroom, so system qualification matters more than on standard SKUs.

Up to DDR5 5600 MT/s, 8 channels, up to 4 TB with ECC feed the cores, and matched DIMMs hold the rated speed. Eighty Gen5 lanes per CPU wire NICs, accelerators and NVMe. Four UPI links at 20 GT/s join sockets into a coherent fabric on Emerald Rapids, while board firmware sets the exact topology.

Cloud scale hosts take this 64-core flagship with 320 MB of shared cache, where two socket nodes replace several older hosts. Boards need a C741 class chipset with the Xeon Platinum 8593Q on the CPU support list, not W790 workstation boards. The Socket vs chipset: what decides whether a CPU works guide covers server board choice, and Intel Xeon Platinum 8571N shows a nearby option on the same socket.

Socket and motherboard compatibility

The 8593Q fits LGA 4677 on single and dual socket server boards with LGA 4677 retention and server power delivery. Board lists must name the Xeon Platinum 8593Q part for qualification. W790 workstation boards target W-series chips instead, so a server SKU will not post there even though the contact count matches.

Server chipset choice decides management and IO breadth rather than CPU fit. C741 class boards carry BMC management, multiple NICs and NVMe backplanes for this power class. A BIOS that lists Emerald Rapids from December 2023 covers the part, while early firmware may need an update for specific stepping IDs. Check the board CPU list before mixing this SKU with other steppings.

Memory, PCIe and cooling

Up to DDR5 5600 MT/s, 8 channels, up to 4 TB with ECC feed the cores, and matched DIMMs hold the rated speed. Population with matched DIMMs holds the rated speed, and eight channel operation needs one DIMM per channel at minimum for full bandwidth. Capacity reaches 4 TB per socket with high density DIMMs.

Eighty Gen5 lanes per CPU wire NICs, accelerators and NVMe. CXL memory expansion shares the same fabric on boards that wire those slots to CPU lanes. Lane bifurcation follows board firmware, so slot population rules come from the board manual.

The 385 W envelope is the highest in the Emerald Rapids batch and needs a high capacity heatsink with front to back airflow and a chassis rated for continuous full load. The 385 W envelope with a 60 °C Tcase ceiling leaves little thermal headroom, so system qualification matters more than on standard SKUs. The 77.5 × 56.5 mm FCLGA4677 package uses a server carrier with even mounting pressure. Paste and torque sequence follow the heatsink maker specification for 385 W parts.

Upgrade paths

On LGA 4677 the upward moves are higher core Platinum parts where VM counts grow, or adding a second Xeon Platinum 8593Q socket where boards allow two socket operation. For this 64-core SKU, memory growth to full eight channel population and NIC additions often help more than clocks.

Outside this SKU, Intel Xeon Platinum 8571N (Xeon Platinum 8571N) on LGA 4677 trims or adds cores for lighter or denser loads. Platinum parts add UPI breadth for larger fabrics, while Silver parts cut cost for single purpose hosts. A move to another socket needs a new board and memory plan, so socket local growth comes first.