Intel Xeon D-1518 socket: BGA 1667
The Intel Xeon D-1518 uses the BGA 1667 package soldered to server boards. It is a 4 core Broadwell-DE SoC with 8 threads at a fixed 2.2 GHz and 35 W.
- Socket
- BGA 1667
- Launched
- March 2015
- Cores and threads
- 4 and 8
- Base power
- 35 W
- Codename
- Broadwell
- Segment
- Server
- Family
- Intel Xeon D
- Clocks
- 2.2 GHz
Intel Xeon D-1518 specifications
| Cores | 4 |
|---|---|
| Threads | 8 |
| Core architecture | Broadwell cores on 14 nm |
| Clocks | 2.2 GHz (no turbo) |
| Cache | 6 MB Smart Cache |
| Processor base power (TDP) | 35 W |
| Manufacturing process | 14 nm |
| Memory support | DDR4 and DDR3 ECC, two channels, up to 128 GB |
| PCI Express | PCIe 2.0 and 3.0, up to 32 lanes |
| Integrated graphics | None |
| ECC memory | Supported |
| Package | FCBGA1667 (37.5 × 37.5 mm, soldered) |
Motherboard compatibility
Intel Xeon D-1518 needs a motherboard with a BGA 1667 socket. Chipset by chipset data for this codename is not recorded yet. See the BGA 1667 chipset list and the board maker's CPU support list.
BGA 1667 at a glance
| Type | BGA, 1,667 contacts |
|---|---|
| Package size | 37.5 × 37.5 mm |
| Introduced | February 2016 |
| Memory | DDR4 and DDR3L with ECC, two channels, up to 128 GB |
| Cooler mounting holes | Not applicable (soldered) |
What the Xeon D-1518 is
The Xeon D-1518 is a fixed clock 4 core Broadwell-DE SoC on BGA 1667 for low power edge servers. Intel set 4 cores and 8 threads at 2.2 GHz with no turbo. Six megabytes of Smart Cache cover steady edge loads. Power is 35 W on 14 nm from March 2015.
Fixed clocks favor predictable behavior in remote boxes with limited cooling. Eight threads handle storage services with background tasks. The SoC integrates networking beside the cores. Single socket boards keep deployment simple.
DDR4 and DDR3 with ECC over two channels to 128 GB feed the node. ECC guards remote data. Buyers pick the D-1518 where 35 W with steady 2.2 GHz beats bursty parts on thermals.
Socket and motherboard compatibility
The D-1518 solders to BGA 1667 with board cooling for 35 W. No swap exists after deployment. Remote sites value steady power draw for UPS planning. Storage and memory choices lock at order time.
Chipset functions ride on the SoC package. The LGA, PGA and BGA: CPU package types explained guide covers soldered server limits. Verify remote management support in the board BMC.
Memory, PCIe and cooling
DDR4 and DDR3 ECC over two channels to 128 GB suit storage edge nodes. Two channels feed four cores with margin. ECC is mandatory for unattended operation.
PCIe 2.0 and 3.0 with up to 32 lanes serve HBAs and NICs. Storage focused nodes use lanes for SATA and NVMe. Integrated networking covers base connectivity.
Cooling uses modest board heatsinks for 35 W with chassis airflow. Fixed clocks ease thermal peaks. Dust filters matter in remote closets.
Upgrade paths
No upgrade path exists soldered. Compare the Intel Xeon D-1520 at 2.2 GHz to 2.6 GHz with turbo nearby, or the Intel Xeon D-1527 at 2.2 GHz to 2.7 GHz with the same 35 W tuning. All share BGA-1667.
A new SoC generation needs a new board. The How to find your CPU socket type guide helps audit soldered edge fleets.
Frequently asked questions
What socket does the Intel Xeon D-1518 use?
It uses BGA 1667, soldered.
How many cores does the Xeon D-1518 have?
4 cores and 8 threads at a fixed 2.2 GHz.
What is the TDP of the Xeon D-1518?
35 W.
When did the Xeon D-1518 launch?
March 2015 with early Broadwell-DE edge parts.
Sources and verification
Facts last checked against these sources on . Page last edited on .