Intel Core Ultra 5 226V socket: BGA 2833

The Intel Core Ultra 5 226V uses BGA 2833, a 27.5 by 27 mm soldered package with on-package LPDDR5X-8533. The 8-core Lunar Lake chip at 17 W cannot be replaced, so the 16 GB memory choice is permanent.

Socket
BGA 2833
Launched
September 24, 2024
Cores and threads
8 and 8
Base power
17 W
Codename
Lunar Lake
Segment
Mobile (soldered)
Clocks
2.1 / 4.5 GHz

Intel Core Ultra 5 226V specifications

Cores8 (4 Performance-cores plus 4 Low Power Efficient-cores)
Threads8 (no Hyper-Threading)
P-core clocks2.1 GHz base, up to 4.5 GHz turbo
E-core clocks2.1 GHz base, up to 3.5 GHz turbo
Cache8 MB Intel Smart Cache (L3), 14 MB L2
Processor base power (TDP)17 W
Maximum turbo power37 W
Manufacturing processTSMC N3B compute tile, N6 platform tile
Memory supportOn-package LPDDR5X-8533, 16 GB, two channels
PCI ExpressPCIe 5.0 x4 plus PCIe 4.0 x4 (8 lanes)
Integrated graphicsIntel Arc 130V with 7 Xe-cores at up to 1850 MHz
NPUIntel AI Boost with up to 40 TOPS
PackageFCBGA2833 (27.5 by 27 mm, soldered)

Motherboard compatibility

Intel Core Ultra 5 226V needs a motherboard with a BGA 2833 socket. Chipset by chipset data for this codename is not recorded yet. See the BGA 2833 chipset list and the board maker's CPU support list.

BGA 2833 at a glance

TypeBGA, 2,833 contacts
Package size27.5 × 27 mm
IntroducedSeptember 2024
MemoryOn-package LPDDR5X-8533, 16 GB or 32 GB configurations, two channels
Cooler mounting holesNot applicable (soldered)

Read the full BGA 2833 socket guide

What the Core Ultra 5 226V is

The Core Ultra 5 226V is an 8-core and 8-thread mobile processor that Intel released on September 24, 2024 with Lunar Lake for thin AI laptops. Four Lion Cove Performance-cores and four Skymont Low Power Efficient-cores give 8 threads with no Hyper-Threading at 2.1 GHz base on both islands, boosting to 4.5 GHz on Performance-cores and 3.5 GHz on Efficient-cores. Cache is 8 MB of Intel Smart Cache with 14 MB of L2 across the die. Processor base power is 17 W with turbo up to 37 W.

On-package memory defines the value case: 16 GB of LPDDR5X-8533 beside the tiles keeps cost down against the 32 GB Intel Core Ultra 5 228V with identical silicon. Buyers whose workloads fit 16 GB save money for the same cores, clocks, graphics and NPU. An Intel AI Boost NPU adds up to 40 TOPS for 97 TOPS of total platform throughput, matching its bigger sibling.

Arc 130V graphics with 7 Xe-cores at up to 1850 MHz drive the display with Xe2 efficiency for media and light play. The compute tile uses TSMC N3B with an N6 platform tile. No unlocked multiplier is documented for V SKUs, so tuning stays at power limits and fan curves.

Socket and motherboard compatibility

The 226V fits BGA 2833 soldered at 27.5 by 27 mm with on-package memory. Laptop makers solder the unit with cooling for the 17 to 37 W band. There is no socket, no retention and no later change to chip or memory, so the 16 GB decision is permanent.

Board designs assume fixed 16 GB with no SODIMM fallback. Makers tune fan tables for 17 W sustained operation with 37 W bursts during AI, creation and update workloads. Radios, storage and display attach through the platform tile with Thunderbolt 4 and Wi-Fi 7 card support.

Shoppers comparing Lunar Lake SKUs meet the same package from the 226V through the 9-series. Memory size decides between the two 5-series twins here, while graphics and NPU tiers separate the 7-series above. The LGA, PGA and BGA: CPU package types explained guide covers why thin designs accept soldered memory for power savings.

Memory, PCIe and cooling

On-package LPDDR5X-8533 at 16 GB across two channels is the fixed configuration. Short traces cut transfer power against socketed designs for longer battery life. Buyers should confirm typical workloads fit 16 GB before committing, since Copilot+ features assume headroom above the OS and browser baseline.

PCIe lanes number 8 in total with 4 Gen5 and 4 Gen4 from the CPU. Thin laptops wire them to NVMe storage and radios rather than discrete graphics, since Arc 130V covers display duty. A fast Gen4 SSD saturates this class without compromise, and Gen5 drives negotiate to the board wiring.

Cooling follows the thin chassis across 8 to 37 W with fans tuned for quiet 17 W operation. No cooler ships with the soldered processor. Sustained AI workloads settle at the power the body rejects, so reviews of the exact model predict real behavior better than the data sheet alone.

Upgrade paths

No processor or memory upgrade exists on soldered boards. The Lunar Lake choice runs from this 16 GB part to the 32 GB Intel Core Ultra 5 228V and higher 7-series tiers, selected at order time for the laptop lifetime. Storage alone changes afterward through the single NVMe slot.

Beyond Lunar Lake the replacement is a whole laptop on newer platforms such as Panther Lake designs on BGA 2540. That move brings newer Xe graphics and higher NPU throughput. For a working 226V machine, a larger SSD and clean OS install extend useful life without touching the soldered core.

Frequently asked questions

What socket does the Core Ultra 5 226V use?

It uses BGA 2833, a soldered 27.5 by 27 mm package with on-package memory. Neither chip nor memory can be replaced.

How does the 226V differ from the 228V?

Silicon matches on cores, clocks, cache, graphics and NPU. Only memory differs: 16 GB on the 226V against 32 GB on the 228V.

Is 16 GB enough on the Core Ultra 5 226V?

For office multitasking with margin, yes. Buyers who keep large AI models resident should take the 32 GB 228V instead, since nothing can be added later.

Does the Core Ultra 5 226V include an NPU?

Yes, Intel AI Boost with up to 40 TOPS and up to 97 TOPS of total platform throughput.

Sources and verification

  1. Intel Core Ultra 5 processor 226V specifications (Intel ARK)
  2. Intel Core Ultra 5 226V vs 268V Lunar Lake specs BGA2833 (Notebookcheck)

Facts last checked against these sources on . Page last edited on .