Intel Core M-5Y10c socket: BGA 1234

The Intel Core M-5Y10c uses the BGA 1234 package soldered to 2 in 1 boards. It is a dual Broadwell-Y part with 4 threads from 800 MHz to 2.0 GHz at 4.5 W.

Socket
BGA 1234
Launched
October 2014
Cores and threads
2 and 4
Base power
4.5 W
Codename
Broadwell-Y
Segment
Mobile (soldered)
Clocks
0.8 / 2.0 GHz

Intel Core M-5Y10c specifications

Cores2
Threads4
Core architectureBroadwell cores on 14 nm
Clocks800 MHz base, up to 2.0 GHz turbo
Cache4 MB Smart Cache
Processor base power (TDP)4.5 W (6 W configurable up)
Manufacturing process14 nm
Memory supportLPDDR3-1600 and DDR3L-1600, two channels, up to 16 GB
PCI ExpressPCIe 2.0, 12 lanes
Integrated graphicsIntel HD Graphics 5300 (up to 800 MHz)
ECC memoryNo
PackageFCBGA1234 (30 × 16.5 mm, soldered)

Motherboard compatibility

Intel Core M-5Y10c needs a motherboard with a BGA 1234 socket. Chipset by chipset data for this codename is not recorded yet. See the BGA 1234 chipset list and the board maker's CPU support list.

BGA 1234 at a glance

TypeBGA, 1,234 contacts
Package size30 × 16.5 mm
IntroducedSeptember 2014
MemoryLPDDR3-1600 and DDR3L-1600, two channels, up to 16 GB
Cooler mounting holesNot applicable (soldered)

Read the full BGA 1234 socket guide

What the Core M-5Y10c is

The Core M-5Y10c is an October 2014 Broadwell-Y part on BGA 1234 for second wave Core M devices. It runs 2 cores and 4 threads at 800 MHz base with turbo to 2.0 GHz. Four megabytes of Smart Cache cover office work. Power is 4.5 W on 14 nm with 6 W configurable up tuning at 1 GHz.

The configurable up mode lifts guaranteed clocks where cooling allows. HD Graphics 5300 up to 800 MHz drives detachable panels. Battery life still leads over bursts in thin bodies. The soldered package means device choice locks everything.

LPDDR3 and DDR3L over two channels to 16 GB feed cores and graphics. The 5Y10c covers autumn 2014 2 in 1 devices with refined firmware over launch steppings.

Socket and motherboard compatibility

The 5Y10c solders to BGA 1234 with fanless cooling for 4.5 W. No swap exists. Second wave devices pair it with faster SSDs. Soldered memory locks configs.

SoC radios and storage serve peripherals. The LGA, PGA and BGA: CPU package types explained guide explains soldered thin limits.

Memory, PCIe and cooling

LPDDR3-1600 and DDR3L-1600 over two channels to 16 GB suit thin bodies. Dual channel feeds HD 5300. Modest memory covers launch era apps.

PCIe 2.0 with 12 lanes serves SSDs and Wi-Fi. Thin SSDs match the power budget. Most builds stay integrated.

Cooling is passive spreading for 4.5 W with 6 W up tuning where bodies allow. Turbo trims with heat.

Upgrade paths

On the same socket, the Intel Core M-5Y10 from September below matches clocks, while the Intel Core M-5Y31 at 900 MHz to 2.4 GHz above adds turbo. All share BGA-1234.

Skylake-Y covers newer thin duty. The 5Y10c holds October Core M value.

Frequently asked questions

What socket does the Intel Core M-5Y10c use?

It uses BGA 1234, soldered.

How many cores does the Core M-5Y10c have?

Two cores and four threads at 800 MHz base with turbo to 2.0 GHz.

When did the Core M-5Y10c launch?

October 2014 with second wave Core M devices.

Sources and verification

  1. Broadwell microarchitecture (Wikipedia, Core M table)
  2. Intel Core M-5Y71 Processor specifications (Intel, Broadwell-Y family data)

Facts last checked against these sources on . Page last edited on .