Intel Core M-5Y10 socket: BGA 1234

The Intel Core M-5Y10 uses the BGA 1234 package soldered to 2 in 1 boards. It is a dual Broadwell-Y part with 4 threads from 800 MHz to 2.0 GHz at 4.5 W with HD Graphics 5300.

Socket
BGA 1234
Launched
September 2014
Cores and threads
2 and 4
Base power
4.5 W
Codename
Broadwell-Y
Segment
Mobile (soldered)
Clocks
0.8 / 2.0 GHz

Intel Core M-5Y10 specifications

Cores2
Threads4
Core architectureBroadwell cores on 14 nm
Clocks800 MHz base, up to 2.0 GHz turbo
Cache4 MB Smart Cache
Processor base power (TDP)4.5 W
Manufacturing process14 nm
Memory supportLPDDR3-1600 and DDR3L-1600, two channels, up to 16 GB
PCI ExpressPCIe 2.0, 12 lanes
Integrated graphicsIntel HD Graphics 5300
ECC memoryNo
PackageFCBGA1234 (30 × 16.5 mm, soldered)

Motherboard compatibility

Intel Core M-5Y10 needs a motherboard with a BGA 1234 socket. Chipset by chipset data for this codename is not recorded yet. See the BGA 1234 chipset list and the board maker's CPU support list.

BGA 1234 at a glance

TypeBGA, 1,234 contacts
Package size30 × 16.5 mm
IntroducedSeptember 2014
MemoryLPDDR3-1600 and DDR3L-1600, two channels, up to 16 GB
Cooler mounting holesNot applicable (soldered)

Read the full BGA 1234 socket guide

What the Core M-5Y10 is

The Core M-5Y10 opens Broadwell-Y on BGA 1234 for fanless 2 in 1 devices. It runs 2 cores and 4 threads at 800 MHz base with turbo to 2.0 GHz. Four megabytes of Smart Cache cover office multitasking. Power is 4.5 W on 14 nm from September 2014.

Low base clocks stretch battery in detachables while turbo covers bursts. HD Graphics 5300 drives high resolution panels for office work. The 4.5 W envelope with 4 W idle points suits sealed bodies. The soldered package means buyers choose configuration once.

LPDDR3 and DDR3L over two channels to 16 GB feed cores and graphics. The 5Y10 covers first wave Core M devices where battery life matters more than burst speed.

Socket and motherboard compatibility

The 5Y10 solders to BGA 1234 at 30 × 16.5 mm with fanless cooling for 4.5 W. No swap exists. Launch devices pair it with SSDs and high DPI displays. Soldered memory locks configs.

Broadwell-Y boards use SoC I/O throughout. The LGA, PGA and BGA: CPU package types explained guide explains soldered thin limits.

Memory, PCIe and cooling

LPDDR3-1600 and DDR3L-1600 over two channels to 16 GB suit premium thin bodies. Soldered LPDDR3 dominates detachables. Dual channel feeds HD 5300 video calls.

PCIe 2.0 with 12 lanes serves SSDs and radios. Thin SSDs match the power budget. Most builds stay on integrated graphics.

Cooling is passive spreading for 4.5 W. Turbo to 2.0 GHz trims with heat. Thin bodies throttle first.

Upgrade paths

On the same socket, the Intel Core M-5Y70 at 1.1 GHz to 2.6 GHz above adds turbo for similar power, while the Intel Core M-5Y10a matches clocks nearby. All share BGA-1234.

Skylake-Y Core m parts cover newer thin devices. The 5Y10 holds launch Core M duty.

Frequently asked questions

What socket does the Intel Core M-5Y10 use?

It uses BGA 1234, soldered. It cannot be replaced.

How many cores does the Core M-5Y10 have?

Two cores and four threads at 800 MHz base with turbo to 2.0 GHz.

Which graphics does the Core M-5Y10 include?

Intel HD Graphics 5300 for thin displays.

When did the Core M-5Y10 launch?

September 2014 with first Core M devices.

Sources and verification

  1. Broadwell microarchitecture (Wikipedia, Core M table)
  2. Intel Core M-5Y71 Processor specifications (Intel, Broadwell-Y family data)

Facts last checked against these sources on . Page last edited on .