Intel Core i9-11900KB socket: BGA 1787

The Intel Core i9-11900KB uses the BGA 1787 package, a grid array that solders to the board. It is an 8-core Tiger Lake-H part at 65 W for small desktop carriers, and the soldered chip cannot be replaced.

Socket
BGA 1787
Launched
May 2021
Cores and threads
8 and 16
Base power
65 W
Codename
Tiger Lake-H
Segment
Mobile (soldered)
Clocks
3.3 / 4.9 GHz

Intel Core i9-11900KB specifications

Cores8
Threads16
Core architectureWillow Cove (Tiger Lake-H)
Clocks3.3 GHz base, up to 4.9 GHz turbo
Cache24 MB Intel Smart Cache (L3)
Processor base power (TDP)65 W
Manufacturing process10 nm SuperFin
Memory supportDDR4 up to 3200 MT/s, two channels, up to 128 GB
PCI ExpressPCIe Gen4 with 20 lanes from the CPU
Integrated graphicsIntel UHD Graphics for 11th Gen (32 execution units, up to 1.45 GHz)
MultiplierUnlocked
PackageFCBGA1787 soldered, 50 × 26.5 mm
Cooler in the boxNone (small chassis cooling)
Launch price$539 (Intel RCP)

Motherboard compatibility

Intel Core i9-11900KB needs a motherboard with a BGA 1787 socket. Chipset by chipset data for this codename is not recorded yet. See the BGA 1787 chipset list and the board maker's CPU support list.

BGA 1787 at a glance

TypeBGA, 1,787 contacts
Package size50 × 26.5 mm
IntroducedMay 2021
MemoryDDR4 up to 3200 MT/s, two channels, up to 128 GB
Cooler mounting holesNot applicable (soldered)

Read the full BGA 1787 socket guide

What the Core i9-11900KB is

The Core i9-11900KB is an 8-core processor that Intel released in the second quarter of 2021 for compact desktop systems that solder the mobile die to a small carrier. Its Willow Cove cores run 3.3 GHz base to 4.9 GHz turbo with Hyper-Threading for 16 threads. Cache is 24 MB of Intel Smart Cache.

The KB suffix marks a BGA desktop part rather than a laptop H part. The 65 W base can drop to 55 W in carriers that set the lower configurable limit. The 10 nm SuperFin process keeps clocks high for a soldered part, with DDR4 memory and Gen4 links carried over from the H45 stack.

Intel UHD Graphics for 11th Gen processors handle display output, with 32 execution units at 350 MHz base and up to 1.45 GHz boost. The multiplier is unlocked on the K part, so board firmware can adjust ratios where the carrier allows it. The package is FCBGA1787 soldered at 50 × 26.5 mm. The launch price was $539 (Intel RCP).

Socket and motherboard compatibility

The 11900KB fits BGA 1787 only. The chip solders to the carrier at the factory, so there is no socket retention and no later processor upgrade. System compatibility is fixed to the carrier and its mobile chipset, not to a desktop board socket.

Because the package is soldered, buyers compare complete mini systems rather than separate boards and chips. A buyer who needs a socketed desktop path steps to LGA 1200 with a Rocket Lake part such as the Intel Core i9-11900K. The KB stays in its compact carrier for its whole service life.

The LGA, PGA and BGA: CPU package types explained guide explains why soldered BGA packages list no cooler mounting pattern. For repair, a failed processor means a carrier replacement through the system maker.

Memory, PCIe and cooling

The memory controller supports DDR4 up to 3200 MT/s in two channels, up to 128 GB. Compact carriers often ship with 2 by 8 GB or 2 by 16 GB soldered or slotted, since dual channel feeds both CPU cores and graphics. The controller does not accept DDR5.

The CPU supplies 20 PCIe Gen4 lanes through the carrier. Makers typically wire x16 to a discrete GPU or high speed slot and x4 to a fast SSD, with Thunderbolt 4 on many designs for docks and external storage. The carrier layout decides the exact split, so the system specifications state which slots run at full speed.

Cooling is part of the small chassis, not a boxed cooler. The 65 W base with turbo headroom needs desktop style airflow in a compact volume. A low profile blower or dual fan carrier cooler with heat pipes was the standard approach. No LGA cooler fits, and the CPU cooler compatibility by socket guide covers why desktop brackets do not apply here.

Upgrade paths

Against the Intel Core i7-11800H, the 11900KB adds higher base clocks and unlocked ratios in a 65 W soldered envelope. The 11800H runs a 35 W to 45 W laptop band, while this part holds 3.3 GHz base for small desktops that can cool more heat. Both share 24 MB of L3 and the same memory limits.

Against socketed 8-core Rocket Lake, the KB trades board choice for size. A socketed build allows later chip swaps on the same board, while the KB locks performance at purchase but fits volumes a tower cannot.

There is no CPU upgrade path on the soldered carrier. The next step is a carrier or system replacement, either with another BGA1787 mini system or a move to a socketed platform. Storage can move with the drive, while memory moves only when the carrier uses slots.

Frequently asked questions

What socket does the Intel Core i9-11900KB use?

It uses BGA 1787, a soldered grid array. The chip cannot be replaced.

How many cores does the Intel Core i9-11900KB have?

8 cores with 16 threads at 3.3 GHz base and up to 4.9 GHz turbo, with 24 MB of Intel Smart Cache.

What memory does the Intel Core i9-11900KB support?

DDR4 up to 3200 MT/s in two channels, up to 128 GB. Dual channel is the expected build.

What graphics does the Intel Core i9-11900KB include?

Intel UHD Graphics for 11th Gen with 32 execution units up to 1.45 GHz. Compact carriers often add a discrete GPU for 3D work.

What is the TDP of the Intel Core i9-11900KB?

65 W base, configurable down to 55 W on carriers that set the lower limit. The small chassis cooler handles turbo bursts above the base.

Sources and verification

  1. Intel Core i9-11900KB specifications (Intel)
  2. Intel Core i9-11900KB Specs (TechPowerUp)

Facts last checked against these sources on . Page last edited on .