Intel Core i7-2675QM socket: BGA 1224
The Intel Core i7-2675QM uses the BGA 1224 package. It is a soldered 45 W quad core Sandy Bridge mobile part at 2.2 GHz with turbo to 3.1 GHz and cannot be replaced.
- Socket
- BGA 1224
- Launched
- October 2011
- Cores and threads
- 4 and 8
- Base power
- 45 W
- Codename
- Sandy Bridge
- Segment
- Mobile (soldered)
- Family
- Intel Core i7
- Clocks
- 2.2 / 3.1 GHz
Intel Core i7-2675QM specifications
| Cores | 4 |
|---|---|
| Threads | 8 |
| Core architecture | Sandy Bridge cores on 32 nm |
| Clocks | 2.2 GHz base, 3.1 GHz turbo |
| Cache | 6 MB Intel Smart Cache (L3) |
| Processor base power (TDP) | 45 W |
| Manufacturing process | 32 nm |
| Memory support | DDR3-1066 and 1333, two channels, up to 16 GB |
| PCI Express | PCIe lanes from the CPU (layout varies by board design) |
| Integrated graphics | Intel HD Graphics 3000 (650 MHz to 1200 MHz) |
| Multiplier | Locked |
| Package | BGA 1224 (FCBGA, 1224 balls, 31.0 × 24.0 mm, soldered) |
Motherboard compatibility
Intel Core i7-2675QM needs a motherboard with a BGA 1224 socket. Chipset by chipset data for this codename is not recorded yet. See the BGA 1224 chipset list and the board maker's CPU support list.
BGA 1224 at a glance
| Type | BGA, 1,224 contacts |
|---|---|
| Package size | 31.0 × 24.0 mm |
| Introduced | January 2011 |
| Memory | DDR3 and DDR3L, two channels, 1333 to 1600 MT/s |
| Cooler mounting holes | Not applicable (soldered) |
What the Core i7-2675QM is
Intel Core i7-2675QM is a quad core Sandy Bridge mobile processor that Intel released in October 2011 for thin soldered performance laptops. It runs at 2.2 GHz base with turbo to 3.1 GHz and includes Hyper-Threading, so 4 cores give 8 threads. Cache is 6 MB Intel Smart Cache. Power is 45 W on a 32 nm process.
The 200 MHz lift over the 2635QM trims waits in threaded creation tasks. Late 2011 thin laptops pair it with discrete GPUs. Fixed board designs keep behavior stable.
Graphics are Intel HD Graphics 3000 at 650 MHz to 1200 MHz. The block covers laptop panels at native resolution. The LGA, PGA and BGA: CPU package types explained guide places this soldered part against socketed forms.
Socket and motherboard compatibility
The Core i7-2675QM solders to BGA 1224 with 1,224 balls and cannot be moved. Each thin model ships with a fixed board and BIOS for this exact string. Factory rework is the only way to change the chip.
The BIOS string must match exactly. The Socket vs chipset: what decides whether a CPU works guide covers why those lists decide upgrades.
Memory, PCIe and cooling
Memory support is DDR3-1066 and 1333, two channels, up to 16 GB. Thin chassis often fix capacity at purchase, so confirm slots before planning an upgrade. ECC is not supported.
PCI Express lanes come from the CPU for discrete graphics, Wi-Fi and storage. Lane wiring varies by laptop design.
Cooling is a slim 45 W assembly with shared pipes for CPU and GPU. Keep vents clear to hold turbo behavior.
Upgrade paths
There is no CPU upgrade path on soldered BGA 1224. The 2675QM cannot be lifted, so a faster thin laptop means a new device. A nearby socketed quad for comparison is the 2670QM class on Socket G2.
Keep the 2675QM laptop for desk duty after a storage refresh. Wipe the drive before passing it on.
Frequently asked questions
What socket does the Intel Core i7-2675QM use?
It uses BGA 1224, a soldered package. The chip cannot be removed.
How is the Core i7-2675QM different from the 2635QM?
Base is 2.2 GHz with 3.1 GHz turbo instead of 2.0 GHz base with 2.9 GHz turbo. Cache and power match.
What memory does the Core i7-2675QM use?
DDR3-1066 and 1333, two channels, up to 16 GB.
Can the Core i7-2675QM be upgraded?
No. Soldered parts need a board or laptop replacement for more speed.
Sources and verification
- Sandy Bridge mobile list (2675QM 2.2 GHz turbo 3.1 Oct 2011 BGA)
- Sandy Bridge (Wikipedia, 2675QM quad Oct 2011)
Facts last checked against these sources on . Page last edited on .