Intel Core i5-1155G7 socket: BGA 1449
The Intel Core i5-1155G7 uses the BGA 1449 package, a grid array that solders to the board. It is a 4-core Tiger Lake-U processor at 28 W, and the soldered chip cannot be replaced.
- Socket
- BGA 1449
- Launched
- May 2021
- Cores and threads
- 4 and 8
- Base power
- 28 W
- Codename
- Tiger Lake-U
- Segment
- Mobile (soldered)
- Family
- Intel Core i5
- Clocks
- 2.5 / 4.5 GHz
Intel Core i5-1155G7 specifications
| Cores | 4 |
|---|---|
| Threads | 8 |
| Core architecture | Willow Cove (Tiger Lake-U) |
| Clocks | 2.5 GHz base at 28 W, up to 4.5 GHz turbo |
| Cache | 8 MB Intel Smart Cache (L3) |
| Processor base power (TDP) | 28 W |
| Manufacturing process | 10 nm SuperFin |
| Memory support | DDR4 up to 3200 MT/s or LPDDR4x up to 4267 MT/s, two channels, up to 64 GB |
| PCI Express | PCIe Gen4 from the CPU plus Thunderbolt 4 through the board |
| Integrated graphics | Intel Iris Xe Graphics (80 execution units, up to 1.35 GHz) |
| Multiplier | Locked |
| Package | FCBGA1449 soldered, 45.5 × 25 mm |
| Cooler in the box | None (laptop cooling) |
Motherboard compatibility
Intel Core i5-1155G7 needs a motherboard with a BGA 1449 socket. Chipset by chipset data for this codename is not recorded yet. See the BGA 1449 chipset list and the board maker's CPU support list.
BGA 1449 at a glance
| Type | BGA, 1,449 contacts |
|---|---|
| Package size | 45.5 × 25 mm |
| Introduced | January 2021 |
| Memory | DDR4 up to 3200 MT/s or LPDDR4x up to 4267 MT/s, two channels, up to 64 GB |
| Cooler mounting holes | Not applicable (soldered) |
What the Core i5-1155G7 is
The Core i5-1155G7 is a 4-core mobile processor that Intel released in the second quarter of 2021 as the fastest i5 of the UP3 refresh. Its Willow Cove cores run a 2.5 GHz base at 28 W to 4.5 GHz turbo with Hyper-Threading for 8 threads. Cache is 8 MB of Intel Smart Cache.
The chip lifts single thread turbo over the earlier i5 UP3 parts while holding the same 28 W envelope. The extra 100 MHz helps office tasks that burst for short periods. The 10 nm SuperFin process keeps efficiency in line for thin bodies.
Intel Iris Xe Graphics handle display output, with 80 execution units at 400 MHz base and up to 1.35 GHz boost. The multiplier is locked. The package is FCBGA1449 soldered at 45.5 × 25 mm.
Socket and motherboard compatibility
The 1155G7 fits BGA 1449 only. The chip solders to the laptop board, so there is no socket retention and no later processor upgrade. Board support is fixed to the UP3 platform with DDR4 up to 3200 MT/s or LPDDR4x up to 4267 MT/s soldered nearby.
Because the package is soldered, buyers compare complete thin laptops rather than separate parts. A buyer who needs more cache and graphics in the same power band steps to an i7 UP3 part in a different chassis. The i5 stays in its office and study role for its whole service life.
The LGA, PGA and BGA: CPU package types explained guide explains why soldered BGA packages list no cooler mounting pattern. For service, a failed processor means a board replacement through the laptop maker.
Memory, PCIe and cooling
The memory controller supports DDR4 up to 3200 MT/s or LPDDR4x up to 4267 MT/s in two channels, up to 64 GB. Thin office laptops often shipped with 16 GB LPDDR4x for responsive multitasking, since soldered memory near the die saves power. Dual channel remains important for Iris Xe speed.
The CPU supplies PCIe Gen4 lanes for storage through the board, with Thunderbolt 4 on many designs for docks and external drives. The board layout decides lane use, so the laptop specifications state which SSD slots run at full speed. Integrated graphics drive the internal panel and up to four displays.
Cooling is part of the thin chassis, not a boxed cooler. The 28 W base with turbo headroom needs a single fan and slim heat pipe. Lower 12 W settings trade sustained clocks for silence. No LGA cooler fits, and the CPU cooler compatibility by socket guide covers why desktop brackets do not apply.
Upgrade paths
Against the Intel Core i5-11300H, the 1155G7 trades H35 sustained power for UP3 efficiency. The H35 i5 part holds higher all core clocks at 35 W, while this UP3 part holds lower heat at 28 W with similar burst speed. Both share soldered boards and memory limits.
There is no CPU upgrade path on the soldered board. The next step is a full laptop replacement, either with another UP3 system of higher tier or a move to a later platform. Storage moves with the drive when the chassis allows it, while memory stays as ordered.
For used buyers, the refresh i5 makes sense for thin office machines with Iris Xe graphics. When more cache matters, the i7 UP3 parts carry 12 MB in the same socket family.
Frequently asked questions
What socket does the Intel Core i5-1155G7 use?
It uses BGA 1449, a soldered grid array. The chip cannot be replaced.
How many cores does the Intel Core i5-1155G7 have?
4 cores with 8 threads, 2.5 GHz base at 28 W and up to 4.5 GHz turbo, with 8 MB of Intel Smart Cache.
What memory does the Intel Core i5-1155G7 support?
DDR4 up to 3200 MT/s or LPDDR4x up to 4267 MT/s in two channels, up to 64 GB. Memory solders to the board.
What graphics does the Intel Core i5-1155G7 include?
Intel Iris Xe Graphics with 80 execution units up to 1.35 GHz for thin panels and external displays.
What is the TDP of the Intel Core i5-1155G7?
28 W configurable up with a 12 W down option. The thin chassis cooler handles turbo bursts above the base.
Sources and verification
- Intel Core i5-1155G7 Processor (Intel)
- Intel brings 5 GHz to ultra-thin laptops (Laptop Mag, covers 1155G7)
Facts last checked against these sources on . Page last edited on .