Intel Core i3-1115G4 socket: BGA 1449
The Intel Core i3-1115G4 uses the BGA 1449 package, a grid array that solders to the board. It is a 2-core Tiger Lake-U processor at 15 W, and the soldered chip cannot be replaced.
- Socket
- BGA 1449
- Launched
- September 2020
- Cores and threads
- 2 and 4
- Base power
- 15 W
- Codename
- Tiger Lake-U
- Segment
- Mobile (soldered)
- Family
- Intel Core i3
- Clocks
- 2.2 / 4.1 GHz
Intel Core i3-1115G4 specifications
| Cores | 2 |
|---|---|
| Threads | 4 |
| Core architecture | Willow Cove (Tiger Lake-U) |
| Clocks | 2.2 GHz base at 15 W, up to 4.1 GHz turbo |
| Cache | 6 MB Intel Smart Cache (L3) |
| Processor base power (TDP) | 15 W (12 to 28 W configurable) |
| Manufacturing process | 10 nm SuperFin |
| Memory support | DDR4 up to 3200 MT/s or LPDDR4x up to 3733 MT/s, two channels, up to 64 GB |
| PCI Express | PCIe Gen4 from the CPU plus Thunderbolt 4 through the board |
| Integrated graphics | Intel UHD Graphics for 11th Gen (48 execution units, up to 1.25 GHz) |
| Multiplier | Locked |
| Package | FCBGA1449 soldered, 45.5 × 25 mm |
| Cooler in the box | None (laptop cooling) |
Motherboard compatibility
Intel Core i3-1115G4 needs a motherboard with a BGA 1449 socket. Chipset by chipset data for this codename is not recorded yet. See the BGA 1449 chipset list and the board maker's CPU support list.
BGA 1449 at a glance
| Type | BGA, 1,449 contacts |
|---|---|
| Package size | 45.5 × 25 mm |
| Introduced | January 2021 |
| Memory | DDR4 up to 3200 MT/s or LPDDR4x up to 4267 MT/s, two channels, up to 64 GB |
| Cooler mounting holes | Not applicable (soldered) |
What the Core i3-1115G4 is
The Core i3-1115G4 is a 2-core mobile processor that Intel launched in September 2020 for thin laptops in the UP3 range. Its Willow Cove cores run a 2.2 GHz base at 15 W to 4.1 GHz turbo with Hyper-Threading for 4 threads. Cache is 6 MB of Intel Smart Cache.
The chip gives thin buyers a dual core entry to Tiger Lake with high single thread boost. The 10 nm SuperFin process pushes one core to 4.1 GHz for responsive app launches. Configurable power from 12 W to 28 W lets makers tune the same die for quiet running or sustained clocks.
Intel UHD Graphics for 11th Gen processors handle display output, with 48 execution units at up to 1.25 GHz. The multiplier is locked. The package is FCBGA1449 soldered at 45.5 × 25 mm.
Socket and motherboard compatibility
The 1115G4 fits BGA 1449 only. The chip solders to the laptop board, so there is no socket retention and no later processor upgrade. Board support is fixed to the UP3 platform with DDR4 or LPDDR4x memory soldered nearby.
Because the package is soldered, buyers compare complete thin laptops rather than separate parts. A buyer who needs four cores in a similar envelope steps to the Intel Core i5-1135G7 with double the threads. A buyer who needs the camera pipeline takes the Intel Core i3-1115G4 (IPU) twin with matching clocks.
The How to find your CPU socket type guide explains how to confirm a soldered package from the system specifications. For service, a failed processor means a board replacement through the laptop maker.
Memory, PCIe and cooling
The memory controller supports DDR4 up to 3200 MT/s or LPDDR4x up to 3733 MT/s across two channels to 64 GB. Thin designs often solder LPDDR4x for idle power, while SO-DIMM boards allow later changes. There is no DDR5 path on Tiger Lake-U.
The processor exposes PCIe Gen4 from the CPU plus Thunderbolt 4 through the board for storage and docks. Laptop designs lean on Thunderbolt where internal lanes stay few. Cooler mounting uses no desktop pattern. Cooling follows the laptop thermal design with a single fan sized around 15 W.
Two cores with four threads cover study and office work without strain. Single thread bursts to 4.1 GHz keep launches snappy, while all-core holds follow the configured TDP. Makers publish the configured value per model, so results vary between quiet and performance tunings.
Upgrade paths
On the same BGA1449 footprint there is no CPU upgrade path, since the chip is soldered. Owners who need four cores move to an i5 UP3 part rather than a chip swap. Memory is often soldered, which closes that path as well.
Within i3 UP3, nearby options are limited to the Intel Core i3-1115G4 (IPU) twin and embedded E variants with lower boost. All share 2 cores, 4 threads and 6 MB cache, so the choice is camera pipeline or embedded ECC rather than speed.
Moving past UP3 entirely means a new laptop on a later platform. For buyers choosing in 2020, the 1115G4 suited thin dual core designs at 15 W, while 4-core i5 parts asked more power. The two share Willow Cove and 10 nm SuperFin on the same package family.
Frequently asked questions
What socket does the Intel Core i3-1115G4 use?
It uses BGA 1449, a soldered grid array with 1449 balls. The chip cannot be removed or replaced.
What memory does the Core i3-1115G4 support?
DDR4 up to 3200 MT/s or LPDDR4x up to 3733 MT/s in two channels to 64 GB. Boards solder the memory or use SO-DIMM per maker choice.
Can the Core i3-1115G4 be overclocked?
No. The multiplier is locked, and laptop firmware does not expose desktop overclocking controls. Sustained speed follows the maker configured value between 12 W and 28 W.
How does the 1115G4 differ from the 1120G4?
The 1115G4 is a 2-core UP3 part with UHD graphics, while the Intel Core i3-1120G4 is a 4-core UP4 part on BGA1598. Both share Willow Cove and 10 nm SuperFin.
Sources and verification
Facts last checked against these sources on . Page last edited on .