Intel Core i3-2115C socket: BGA 1284

What the Core i3-2115C is

Intel Core i3-2115C is a dual core Sandy Bridge embedded processor that Intel released in May 2012 for carriers with soldered boards. It runs at a fixed 2.0 GHz with no turbo, with 3 MB Intel Smart Cache and Hyper-Threading for 4 threads. Power is rated at 25 W on a 32 nm process. The list entry that places it on LGA 1155 at 65 W as a desktop part is wrong; the Intel MDDS record shows BGA-1284 soldered with embedded qualification, and the IOMMU hardware table citing ARK confirms Sandy Bridge at 2 GHz with 3 MB, 32 nm and 25 W.

Graphics are Intel HD Graphics 2000 without published clocks on the sources opened, so no frequency range is claimed here. The block covers control displays without a card. Memory is DDR3-1333 in two channels for up to 32 GB, with ECC on qualified carriers for always on service.

The 25 W envelope with ECC suits communications and control carriers that need two fast threads without quad heat. Fixed firmware locks the lifecycle for years. The LGA, PGA and BGA: CPU package types explained guide contrasts this soldered BGA part with socketed desktop i3 chips.

Socket and motherboard compatibility

The Core i3-2115C solders to BGA 1284 with 1,284 balls and cannot be moved. The MDDS order data shows the BGA-1284 package with two DDR3-1333 channels, and carriers qualify each model with a fixed board and BIOS. Another BGA part is not a field swap even within the same balls.

The BIOS must list the exact Core i3-2115C string with ECC wiring where used. The 25 W heatsink is sized by the carrier for the enclosure. The CPU cooler compatibility by socket guide notes soldered parts have no desktop mount.

Memory, PCIe and cooling

Memory support is DDR3-1333, two channels, up to 32 GB, with ECC where the board wires it. ECC suits control loads that run for months without reboot. Capacity follows the carrier design.

PCI Express lanes come from the CPU with a layout that varies by carrier design. No lane count or revision is claimed here, since the sources opened do not publish them for this SKU. Carriers spend lanes on network and storage I/O.

Cooling uses the carrier solution for 25 W. Sealed boxes rely on conduction and enclosure airflow. Service is limited to cleaning and drive swaps.

Upgrade paths

There is no CPU upgrade path on soldered BGA 1284. The Core i3-2115C cannot be removed, so a faster carrier means a new board or a new box. Within the Gladden and Sandy embedded family on the same package, Xeon E3 quads show the higher thread option, but carriers rarely exchange models.

A platform move means a new embedded box on a current BGA package. Recycle the old unit through a proper e waste path once data is wiped.