Intel Atom Z605 socket: BGA 518
The Intel Atom Z605 uses BGA 518, the 518-ball soldered package for Lincroft handheld processors. It is a single core Bonnell SoC with two threads at 1 GHz and a 2.2 W TDP without Burst graphics.
- Socket
- BGA 518
- Launched
- May 4, 2010
- Cores and threads
- 1 and 2
- Base power
- 2.2 W
- Codename
- Lincroft
- Segment
- Mobile (soldered)
- Family
- Intel Atom
- Clocks
- 1.0 GHz
Intel Atom Z605 specifications
| Cores | 1 |
|---|---|
| Threads | 2 |
| Core architecture | Lincroft on 45 nm |
| Clocks | 1 GHz (no turbo) |
| Cache | 512 KB L2, no L3 |
| Processor base power (TDP) | 2.2 W |
| Manufacturing process | 45 nm |
| Memory support | DDR-400 or DDR2-800, single channel |
| PCI Express | No PCIe from CPU, I/O from companion chip |
| Integrated graphics | None (display via companion) |
| Multiplier | Locked |
| Package | FC-BGA 518 (soldered, 13.8 × 13.8 mm) |
Motherboard compatibility
Intel Atom Z605 needs a motherboard with a BGA 518 socket. Chipset by chipset data for this codename is not recorded yet. See the BGA 518 chipset list and the board maker's CPU support list.
BGA 518 at a glance
| Type | BGA, 518 contacts |
|---|---|
| Package size | 13.8 × 13.8 mm |
| Introduced | May 2010 |
| Memory | DDR2-800, single channel |
| Cooler mounting holes | Not applicable (soldered) |
What the Atom Z605 is
The Intel Atom Z605 is the 1 GHz Lincroft member on BGA 518 without integrated Burst graphics. It runs one Bonnell core with Hyper-Threading for two threads at 1 GHz, backed by 512 KB of L2 cache. Power is rated at 2.2 W on a 45 nm process. Intel lists May 4, 2010 as the launch date.
The Z605 is the only Lincroft in this batch without Burst Performance Technology, so its clock stays fixed. Display runs through the companion chip rather than on die graphics. Against the 800 MHz Z610 it leads by 200 MHz at higher power.
Memory is single-channel DDR-400 or DDR2-800 fixed per design.
Socket and motherboard compatibility
The Atom Z605 is soldered to the board in BGA 518 and cannot be replaced.
Firmware must match the sSpec stepping with the Langwell companion. The CPU cooler compatibility by socket guide covers soldered rules.
Memory, PCIe and cooling
Memory is single-channel DDR-400 or DDR2-800 on the Z605, fixed per design.
There is no PCIe from the CPU. Board I/O comes from the companion chip.
Cooling is passive by design for the 2.2 W envelope.
Upgrade paths
There is no CPU upgrade path on BGA 518 because the chip is soldered. A Z615 adds on die graphics and higher clocks where the vendor offers that design.
Frequently asked questions
What socket does the Intel Atom Z605 use?
BGA 518 (FC-BGA 518), the soldered 518-ball package. The chip cannot be removed.
How are the cores of the Z605 arranged?
One Lincroft core with Hyper-Threading for two threads at 1 GHz, with 512 KB of L2 cache.
What memory does the Z605 need?
DDR-400 or DDR2-800 single channel, fixed per design.
Sources and verification
Facts last checked against these sources on . Page last edited on .