AMD Sempron 2200+ socket: Socket 462

What the Sempron 2200+ is

The AMD Sempron 2200+ is a 1500 MHz single-core desktop processor from July 2004. It runs one K7 core at 1500 MHz with no turbo, so 1 core gives 1 thread. Cache is 256 KB of L2 next to 64 KB of L1 instruction and 64 KB of L1 data cache on a 130 nm process. Power is rated at 62 W in a Socket 462 package.

The 2200+ belongs to the Thoroughbred-B group on Socket A, model 8, with part number SDA2200DUT3D. It runs a 333 MT/s front side bus from a 166 MHz clock with a 9x multiplier at 1.60 V. AMD positioned Sempron as the replacement for Duron in budget DDR towers, with the 2200+ as the entry point of the Thoroughbred-B desktop line from 1500 MHz to 2000 MHz. The chip supports MMX, SSE and Enhanced 3DNow instructions.

Thoroughbred-B matters because it carried the early Sempron ratings on the same 130 nm base as late Athlon XP Thoroughbred parts. The 2200+ shares its 1500 MHz, 256 KB and 62 W rating with a Thorton variant listed under a different part number, which explains why two core names appear for one model number in some lists. This page covers the Thoroughbred-B SDA2200DUT3D as listed for July 2004.

Socket and motherboard compatibility

The Sempron 2200+ fits Socket 462 DDR boards with a 333 MT/s front side bus and a BIOS that lists Thoroughbred Sempron parts. It needs a board with DDR slots and voltage handling for 1.60 V operation, not a Socket 754 or Socket 939 board with an on-chip memory controller. The Socket vs chipset: what decides whether a CPU works guide covers pairing rules.

Official AMD chipsets for the platform include the AMD 760 with the AMD 761 northbridge for 266 MT/s operation with DDR and AGP 4x, while most retail boards use third party chipsets such as VIA K series or nForce2. A 333 MT/s Barton era board with DDR slots is the natural match, with the exact CPU support list deciding fit. Older 200 MT/s boards with SDRAM need a BIOS and timing check before fitting a 333 MT/s Thoroughbred part. Forcing the chip into a Socket 370 or Socket 754 board can damage the package.

Memory, PCIe and cooling

Memory is DDR through the board chipset in a single channel. Boards commonly carry two or three DIMM sockets for modules matched to the 333 MT/s bus, with the chipset setting the usable speed and capacity. The CPU carries no memory controller, so the board chipset decides timing and stability.

No PCI Express lanes come from the processor. A 333 MT/s front side bus ties the CPU to the chipset, while AGP 4x and PCI slots hang off the chipset for graphics and expansion. Integrated graphics, where present, comes from the board chipset rather than the CPU. Cooling clips to the socket lug with the load centered on the exposed die. AMD rates the maximum cooler mass at 300 grams, and boards with four holes in a 35 mm by 65 mm rectangle accept larger heatsinks where fitted. A cooler rated for 62 W with fresh paste suits the 2200+ in a tower with normal airflow.

Upgrade paths

On Socket 462 the upgrade is the Sempron 2400+ at 1667 MHz or the Sempron 2600+ at 1833 MHz with the same 256 KB of L2 cache and 62 W rating, or the Sempron 2300+ at 1583 MHz as a smaller step. A Barton Sempron 3000+ at 2000 MHz with 512 KB suits boards with 333 MT/s support and a BIOS that lists Barton parts. Beyond Socket 462 a move to Socket 754 needs a new board and DDR modules matched to the new chipset, with models such as the Sempron 3100+ on the Paris core as the next budget step. The soldered BGA path does not apply here, since the 2200+ is a socketed PGA part that lifts out with the lever open.