AMD Athlon XP-M 2800+ (72W) socket: Socket 462

What the Athlon XP-M 2800+ (72W) is

The AMD Athlon XP-M 2800+ (72W) is a 2.133 GHz standard power mobile processor from July 2004. It runs one K7 Barton core at 2.133 GHz with no turbo, so 1 core gives 1 thread. Cache is 512 KB of L2 with 64 KB of L1 instruction and 64 KB of L1 data cache on a 130 nm process. Power is rated at 72 W in a Socket 462 mobile package for large notebooks.

The parenthetical 72W separates this bin from the 55 W XP-M 2800+ at the same 2.133 GHz and 512 KB rating. Both use Socket 462 packages with PowerNow support, yet the 72 W bin targets chassis with larger heat pipe assemblies and higher sustained clocks under load. Desktop Barton 2800+ parts at 2083 MHz carry a 68.3 W rating at 1.65 V, so the 72 W mobile bin sits slightly above the desktop power level while keeping notebook power management. Instructions include MMX, SSE and Enhanced 3DNow with PowerNow control.

Model suffixes with wattage exist because mobile bins with identical clocks need different thermal designs. A notebook qualified for a 55 W XP-M cannot assume support for the 72 W bin, even though the model number matches apart from the suffix. The suffix is part of the model on this site for that reason, giving the 72W bin its own page and slug.

Socket and motherboard compatibility

The 72W bin fits Socket 462 notebooks with DDR memory, a 72 W thermal design and a BIOS that lists the 72W XP-M part. It needs a large notebook board with Socket 462 lands and mobile power delivery, not a thin Socket 563 microPGA board or a Socket 754 K8 board. The Socket vs chipset: what decides whether a CPU works guide covers pairing rules.

Maker qualification is strict here. A 72 W heat pipe assembly, fan curve and power table must match the bin, so only chassis that list the 72W suffix accept the chip with full stability. Swapping a 72W chip into a 55 W chassis risks overheating and shutdowns under load. Forcing the package into Socket 563 or Socket 754 can damage pins.

Memory, PCIe and cooling

Memory is DDR through the board chipset in a single channel. SO-DIMM count and ceiling capacity are fixed by the notebook, with speed tied to the Barton mobile bus. The CPU has no memory controller.

Expansion comes from the mobile chipset. The front side bus ties the CPU to the chipset, while AGP handles graphics and PCI handles other devices. No PCIe lanes originate on the die. Cooling is the notebook 72 W heat pipe assembly for the exact model, with PowerNow trimming clocks at idle. Dust buildup and dried paste show quickly at 72 W, so service means cleaning vents and renewing interface material with the maker specified type.

Upgrade paths

On Socket 462 the cooler mobile step is the 55 W XP-M 2800+ at the same 2.133 GHz for chassis with smaller cooling, when the maker lists that bin. Desktop Barton 3000+ parts at 2100 MHz offer similar clocks in tower boards with desktop heatsinks. Thin notebook designs use Socket 563 Barton parts such as the XP-M 2200+ at 1667 MHz at 27 W instead, trading clocks for a smaller package and lower power. Beyond Socket 462 a move to Socket 754 needs a new notebook for Mobile Athlon 64 low power parts. The 72W chip removes with the lever, so qualified chassis swaps need no solder work.