AMD Ryzen Embedded R1305G socket: FP5
The AMD Ryzen Embedded R1305G uses the FP5 package, soldered with 1140 balls. It is a 2-core Banded Kestrel embedded part at 10 W, and the soldered chip cannot be replaced.
- Socket
- FP5
- Launched
- February 2020
- Cores and threads
- 2 and 4
- Default TDP
- 10 W
- Codename
- Banded Kestrel
- Segment
- Embedded
- Family
- AMD Ryzen Embedded
- Clocks
- 1.5 / 2.8 GHz
AMD Ryzen Embedded R1305G specifications
| Cores | 2 |
|---|---|
| Threads | 4 |
| Core architecture | Zen (Banded Kestrel) |
| Clocks | 1.5 GHz base, up to 2.8 GHz boost |
| Cache | 4 MB L3 |
| Default TDP | 10 W |
| Manufacturing process | 14 nm |
| Memory support | DDR4, two channels |
| PCI Express | PCIe 3.0 from the CPU |
| Integrated graphics | Radeon Vega graphics |
| Multiplier | Locked |
| Package | FP5 soldered, 1140 balls |
| Cooler in the box | None (board heatsink) |
Motherboard compatibility
AMD Ryzen Embedded R1305G needs a motherboard with a FP5 socket. Chipset by chipset data for this codename is not recorded yet. See the FP5 chipset list and the board maker's CPU support list.
FP5 at a glance
| Type | BGA, 1,140 contacts |
|---|---|
| Package size | 35 × 25 mm |
| Introduced | January 2018 |
| Memory | DDR4 up to 2400 MT/s, two channels |
| Cooler mounting holes | Not applicable (soldered) |
What the Ryzen Embedded R1305G is
The Ryzen Embedded R1305G is a 2-core embedded processor that AMD placed in the Banded Kestrel R1000 range in February 2020 for FP5 boards. Its Zen cores run 1.5 GHz base with boost up to 2.8 GHz across 4 threads. Cache is 4 MB of L3, and the 14 nm process suits small embedded boxes with active or passive cooling.
The chip targets embedded systems that need four threads with display output at modest power. The 10 W envelope covers kiosks, signage players and thin clients with headroom over the 6 W R1102G. The FP5 package solders to the board with 1140 balls, so there is no socket retention.
Radeon Vega graphics handle display output with dual display support on many boards. The multiplier is locked. Long lifecycle support for embedded boards matters more than headline clocks in this segment.
Socket and motherboard compatibility
The R1305G fits the FP5 package only. The chip solders to the embedded board, so there is no socket retention and no later processor upgrade. Board support is fixed to FP5 embedded platforms with DDR4 memory.
Because the package is soldered, buyers compare complete boards rather than separate parts. A buyer who needs the lowest power in the same family steps down to the AMD Ryzen Embedded R1102G with 2 threads at 6 W. A buyer who needs more CPU steps to R2000 Picasso embedded parts such as the AMD Ryzen Embedded R2312 on the same footprint.
The How to find your CPU socket type guide explains how to confirm a soldered package from the board specifications. For service, a failed processor means a board replacement through the vendor.
Memory, PCIe and cooling
The memory controller supports DDR4 across two channels on FP5 embedded boards. Vendors validate specific SO-DIMM or soldered DDR4 layouts per board, with 4 GB to 8 GB common for signage and clients. There is no DDR5 path on FP5.
The processor exposes PCIe 3.0 lanes for storage, networking and expansion. Embedded boards split the lanes between NVMe or SATA, Ethernet and serial I/O, with exact splits fixed per design. Cooler mounting uses no desktop pattern. Cooling follows the board thermal design with compact heatsinks sized for 10 W, and the CPU cooler compatibility by socket guide places soldered embedded cooling against desktop mounts.
Four threads at 10 W cover multitasking in kiosks without strain. Browsing, playback and remote management spread over logical threads, while passive cooling stays possible where the chassis meets the vendor specification. Power supply choice follows the board input range.
Upgrade paths
On the same FP5 footprint there is no CPU upgrade path, since the chip is soldered. Owners who need more performance move to another FP5 board with a higher R1000 or R2000 part rather than a chip swap. Storage and memory configuration remain the only practical changes.
Within Banded Kestrel, the nearby step down is the AMD Ryzen Embedded R1102G for 6 W fanless use. Both share 14 nm, FP5 and Vega graphics, so the choice is threads and power rather than platform. The R2000 Picasso range on the same footprint adds Zen+ cores where vendors offer compatible boards.
Moving past FP5 entirely means a new board on a later embedded platform. For buyers choosing in 2020, the R1305G suited 10 W clients with thread doubling, while the R1102G asked 6 W without it. The two share Banded Kestrel and FP5, but each ships soldered to its own board.
Frequently asked questions
What socket does the AMD Ryzen Embedded R1305G use?
It uses FP5, soldered with 1140 balls. The chip cannot be removed, so an upgrade means replacing the board.
What memory does the R1305G support?
DDR4 in two channels. Vendors validate specific SO-DIMM or soldered layouts per board for signage and clients.
Can the R1305G be overclocked?
No. The multiplier is locked, and embedded firmware does not expose desktop overclocking controls. The 10 W envelope suits compact heatsinks.
How does the R1305G differ from the R1102G?
The R1305G has 2 cores and 4 threads at 10 W, while the AMD Ryzen Embedded R1102G has 2 cores and 2 threads at 6 W. Both share Banded Kestrel, FP5 and 14 nm.
Sources and verification
- List of AMD processors with 3D graphics - Banded Kestrel R1000 (Wikipedia)
- AMD Ryzen 3 3250U specifications - FP5 14nm family reference (AMD)
Facts last checked against these sources on . Page last edited on .