AMD Opteron A1170 socket: SP1
The AMD Opteron A1170 uses the SP1 socket as a soldered BGA SoC and cannot be replaced. It is an eight core Seattle ARM server chip at 2.0 GHz and 32 W with DDR4 and ECC for network nodes.
- Socket
- SP1
- Launched
- January 14, 2016
- Cores and threads
- 8 and 8
- Default TDP
- 32 W
- Codename
- Seattle
- Segment
- Server
- Family
- AMD Opteron
- Clocks
- 2.0 GHz
AMD Opteron A1170 specifications
| Cores | 8 |
|---|---|
| Threads | 8 |
| Core architecture | ARM Cortex-A57 (Seattle) cores on 28 nm |
| Clocks | 2.0 GHz (no boost) |
| Cache | 4 MB L2 shared, 8 MB L3 shared |
| Default TDP | 32 W |
| Manufacturing process | 28 nm |
| Memory support | DDR3L and DDR4 with ECC, two channels, up to 1866 MT/s |
| PCI Express | PCIe 3.0, 8 lanes |
| Integrated graphics | None (server SoC) |
| Multiplier | Locked |
| Package | Socket SP1 (BGA, 1021 contacts) |
Motherboard compatibility
AMD Opteron A1170 needs a motherboard with a SP1 socket. Chipset by chipset data for this codename is not recorded yet. See the SP1 chipset list and the board maker's CPU support list.
SP1 at a glance
| Type | BGA, 1,021 contacts |
|---|---|
| Package size | 27 × 27 mm |
| Introduced | January 2016 |
| Memory | DDR3L and DDR4 with ECC, two channels, up to 1866 MT/s |
| Cooler mounting holes | Not applicable (soldered) |
What the Opteron A1170 is
The Opteron A1170 brings Seattle to SP1 for fast request handling with DDR4. It launched on January 14, 2016 with eight Cortex-A57 cores at 2.0 GHz and 32 W. AMD targets web front ends that need ARM threads with ECC and fast network on one chip.
Four megabytes of shared L2 plus 8 MB of shared L3 carry connection tables and caches. The higher clock trims tail latency. Eight threads cover handlers plus background tasks.
There is no integrated GPU, so serial and network manage the node. The process is 28 nm at GlobalFoundries. The multiplier is locked. DDR3L and DDR4 with ECC in two channels feed cores with up to 1866 MT/s on DDR4.
Buyers choose the board at order time with memory and network tier. The 32 W rating suits dense shelves. TrustZone and crypto units help secure boot.
Socket and motherboard compatibility
The Opteron A1170 is soldered to the board on SP1 and cannot be replaced. Upgrading means replacing the board or the whole node. Boards pair the SoC with RDIMM slots and SFP cages.
SP1 boards wire PCIe 3.0, SATA and Ethernet per server design. FT3 boards cannot take this chip. The LGA, PGA and BGA: CPU package types explained guide explains soldered packages.
Single socket nodes are the deployment. Growth means more SP1 nodes. Service follows the board manual.
Memory, PCIe and cooling
DDR3L and DDR4 with ECC in two channels suit web nodes. DDR4 at 1866 MT/s lifts throughput. Start with 64 GB for front ends.
PCIe 3.0 with 8 lanes serves HBAs and NICs. The SoC adds 14 SATA ports and dual 10 Gb Ethernet. Network boot trims disks.
Cooling has no retail mount because the SoC is soldered lidless. Vendors design heatsinks for 32 W with front to back airflow.
Upgrade paths
On the same socket, the AMD Opteron A1150 gives eight cores at 1.7 GHz for cooler stores. The AMD Opteron A1120 drops to four cores at 25 W for gateways. Both share SP1 boards.
x86 Opteron X2170 stays on FT3 for embedded control.
Past ARM racks move to later server parts. The A1170 covers 2016 front ends where eight ARM cores at 2.0 GHz must run at 32 W.
Frequently asked questions
What socket does the AMD Opteron A1170 use?
It uses SP1 as a soldered SoC and cannot be replaced.
How many cores does the Opteron A1170 have?
Eight ARM cores and eight threads at 2.0 GHz.
Which graphics does the Opteron A1170 include?
None. Serial and network manage the node.
What memory does the Opteron A1170 support?
DDR3L and DDR4 with ECC in two channels.
When did the Opteron A1170 launch?
January 14, 2016 with Seattle SoCs.
Sources and verification
Facts last checked against these sources on . Page last edited on .