Qualcomm BGA 1287 socket: CPUs, chipsets and cooler fit

Qualcomm BGA 1287 is a soldered package for Snapdragon C1 laptop processors. It is a ball grid array with 1,287 contacts for thin entry laptops launched in August 2026.

Quick facts

MakerQualcomm
Package typeBGA
Contacts1,287
Package sizen/a
IntroducedAugust 2026
StatusCurrent
MemoryLPDDR5/5x up to 6400 MT/s or LPDDR4x up to 4200 MT/s, to 16 GB
PCIe from the CPUPCIe 3.0 with 3 lanes
Cooler mounting holesNot applicable (soldered)
ReplacesNone
Replaced byNone

Overview

The package carries an 8-core Kryo 670 processor with integrated graphics and AI acceleration for everyday Windows tasks at 7 W. Boards are vendor designs with soldered memory, so the configuration is fixed at purchase.

C1 sits below the Snapdragon X lines. Laptop choice is the upgrade path, since the soldered chip cannot be swapped.

Processor generations

CodenameMarketing nameYearsNotes
Kryo 670Snapdragon C1 series2026Entry laptop processors launched in August 2026.

Soldered package

BGA 1287 processors are soldered and cannot be removed or replaced. Cooling follows the laptop design for the low-power class, and memory is soldered on typical boards.

Compare full laptop designs including display, battery and ports, since the processor cannot be upgraded later.

CPUs on Qualcomm BGA 1287

1 processor page in the database, newest first.

ProcessorCores / threadsBase / boostTDPLaunched
Qualcomm Snapdragon C1-10-1008 / 82.0 / 3.0 GHz7 WAug 2026

Frequently asked questions

Can a BGA 1287 processor be upgraded?

No. The processor is soldered to the board, so an upgrade means replacing the board or the whole laptop.

Which processors fit Qualcomm BGA 1287?

Snapdragon C1 processors such as the C1-10-100, an 8-core entry part.

Sources and verification

  1. Snapdragon C Platform Product Brief (Qualcomm)
  2. Introducing Snapdragon C (Qualcomm, May 2026)
  3. Qualcomm details Snapdragon C specs (Tom's Hardware, Aug 2026)

Facts last checked against these sources on . Page last edited on .