BGA 5903 socket: CPUs, chipsets and cooler fit
BGA 5903 is Intel ball grid array package for Xeon Platinum 9200 Cascade Lake-AP server processors. The package carries 5903 contacts and solders directly to large compute boards. Intel lists the package as FC-BGA5903 in specification databases, with dual die construction for high core counts.
Quick facts
| Maker | Intel |
|---|---|
| Package type | BGA |
| Contacts | 5,903 |
| Package size | n/a |
| Introduced | April 2019 |
| Status | Legacy |
| Memory | DDR4-2933 ECC, twelve channels |
| PCIe from the CPU | PCIe 3.0 from the processors for storage and accelerators |
| Cooler mounting holes | Not applicable (soldered) |
| Replaces | None |
| Replaced by | None |
Overview
The package arrived in April 2019 with four SKUs from 32 cores to 56 cores. The 32 core 9221 and 9222 run at 250 W with 71.5 MB of cache, while the 48 core 9242 runs at 350 W and the 56 core 9282 runs at 400 W with 77 MB. All four share DDR4-2933 in twelve channels for large memory bandwidth.
Memory stays DDR4 ECC across the family, with twelve channels feeding data hungry HPC and AI training nodes. PCIe runs at version 3.0 for NVMe and accelerators. Because the chips solder down, core count and memory size are fixed at purchase and service follows node replacement rather than socket swaps.
Processor generations
| Codename | Marketing name | Years | Notes |
|---|---|---|---|
| Cascade Lake-AP | Xeon Platinum 9200 series | 2019 | Dual die server processors with 32 to 56 cores and 12 channel DDR4-2933, launched in April 2019 on BGA 5903 with 250 W to 400 W classes. |
Who BGA 5903 serves
BGA 5903 processors belong in dense compute nodes where core count and memory bandwidth matter more than socket flexibility: HPC clusters, AI training racks and large virtualization hosts with liquid or high airflow cooling. The 250 W to 400 W envelope needs purpose built chassis rather than tower cases.
Within Cascade Lake-AP the choice runs from 32 core 9221 parts for balanced compute through 48 core 9242 parts for parallel throughput to 56 core 9282 flagships for maximum density. All four share twelve channel DDR4-2933, so buyers choose core count against power and price. Nodes that need less density use LGA 3647 single die parts instead.
Memory and PCIe
Memory support covers DDR4 ECC RDIMMs up to 2933 MT per s in twelve channels. Bandwidth scales with channel count for memory bound solvers. Population follows vendor rules for large capacities, since twelve channels ask for careful DIMM matching.
PCIe arrives as version 3.0 for NVMe storage and accelerators. System designs wire lanes to fast SSDs and fabric adapters beside the processor complex. Gen4 drives run at Gen3 speed here, which still covers large dataset staging.
Identifying and servicing BGA 5903
Identification in specification databases reads Package FC-BGA5903 with Socket BGA 5903. That line separates BGA 5903 from LGA 3647 server parts, which read FCLGA3647 with a land grid. The LGA, PGA and BGA: CPU package types explained guide explains soldered package trade offs.
Service means whole node service. There is no retention bracket and no cooler to swap from retail stock. Thermal paste and heatsink mounting follow the system vendor manual, and board replacement is the only path when a processor fails. The How to find your CPU socket type guide shows where vendor specs list the package.
CPUs on BGA 5903
4 processor pages in the database, newest first.
| Processor | Cores / threads | Base / boost | TDP | Launched |
|---|---|---|---|---|
| Intel Xeon Platinum 9221 | 32 / 64 | 2.3 / 3.7 GHz | 250 W | Jul 2019 |
| Intel Xeon Platinum 9222 | 32 / 64 | 2.3 / 3.7 GHz | 250 W | Jul 2019 |
| Intel Xeon Platinum 9242 | 48 / 96 | 2.3 / 3.8 GHz | 350 W | Apr 2019 |
| Intel Xeon Platinum 9282 | 56 / 112 | 2.6 / 3.8 GHz | 400 W | Apr 2019 |
Frequently asked questions
Can a BGA 5903 processor be replaced or upgraded?
No. The processors solder to the board. Upgrading means replacing the board or the whole node, so choose core count and memory size at order time.
What is the difference between BGA 5903 and LGA 3647?
BGA 5903 at 5903 contacts serves 32 to 56 core Cascade Lake-AP parts with 12 channel DDR4 and up to 400 W. LGA 3647 at 3647 contacts serves single die Skylake-SP and Cascade Lake-SP with six channel memory. The two packages do not interchange.
What memory does BGA 5903 use?
Boards use DDR4 ECC RDIMMs up to 2933 MT per s in twelve channels. Capacity follows vendor population rules for large memory nodes.
What PCIe does BGA 5903 provide?
PCIe 3.0 from the processors for NVMe storage and accelerators. Exact lane wiring follows the system design, so check the vendor specifications for slot speed.
Sources and verification
- Intel Xeon Platinum 9221 Processor specifications (Intel)
- Intel Xeon Platinum 9282 Processor specifications (Intel)
- Intel Xeon Platinum Cascade Lake-AP Processors List (SysRqmts)
Facts last checked against these sources on . Page last edited on .