BGA 2114 socket: CPUs, chipsets and cooler fit
BGA 2114 is Intel's soldered package for Arrow Lake-HX mobile processors. It is a ball grid array with 2,114 contacts, and the package measures 30.2 × 37.5 mm. The HX line launched in 2025 with desktop-derived silicon for performance laptops.
Quick facts
| Maker | Intel |
|---|---|
| Package type | BGA |
| Contacts | 2,114 |
| Package size | 30.2 × 37.5 mm |
| Introduced | January 2025 |
| Status | Current |
| Memory | DDR5 (speeds and capacity per laptop design) |
| PCIe from the CPU | PCIe 5.0 and PCIe 4.0 (lane counts per board design) |
| Cooler mounting holes | Not applicable (soldered) |
| Replaces | BGA 1964 |
| Replaced by | None |
Overview
HX processors bring high core counts and 55 W base power to laptops that stay plugged in most of the time. The Plus refresh of March 2026 raises clocks within the same package and power envelope.
The package is soldered with board-specific memory and cooling, so the processor choice is fixed at purchase along with the rest of the platform.
Processor generations
| Codename | Marketing name | Years | Notes |
|---|---|---|---|
| Arrow Lake-HX | Core Ultra 200HX series | 2025 | Desktop-derived HX mobile processors launched in 2025. |
| Arrow Lake-HX Refresh | Core Ultra Plus HX series | 2026 | Refreshed HX parts including the 270HX Plus and 290HX Plus, launched in March 2026. |
Soldered package
BGA 2114 processors are soldered with 2,114 balls and cannot be removed or replaced. Cooling follows the laptop design for the 55 W HX class, and memory is typically DDR5 SODIMM chosen by the vendor.
Buyers should compare full laptop designs rather than chips, since the same processor can behave differently under different power limits and cooling.
CPUs on BGA 2114
8 processor pages in the database, newest first.
| Processor | Cores / threads | Base / boost | TDP | Launched |
|---|---|---|---|---|
| Intel Core Ultra 7 270HX Plus | 20 / 20 | 2.4 / 5.3 GHz | 55 W | Mar 2026 |
| Intel Core Ultra 9 290HX Plus | 24 / 24 | 2.7 / 5.5 GHz | 55 W | Mar 2026 |
| Intel Core Ultra 5 235HX | 14 / 14 | 2.9 / 5.1 GHz | 55 W | Jan 2025 |
| Intel Core Ultra 5 245HX | 14 / 14 | 3.1 / 5.1 GHz | 55 W | Jan 2025 |
| Intel Core Ultra 7 255HX | 20 / 20 | 2.4 / 5.2 GHz | 55 W | Jan 2025 |
| Intel Core Ultra 7 265HX | 20 / 20 | 2.6 / 5.3 GHz | 55 W | Jan 2025 |
| Intel Core Ultra 9 275HX | 24 / 24 | 2.7 / 5.4 GHz | 55 W | Jan 2025 |
| Intel Core Ultra 9 285HX | 24 / 24 | 2.8 / 5.5 GHz | 55 W | Jan 2025 |
Frequently asked questions
Can a BGA 2114 processor be upgraded?
No. The processor is soldered to the board, so an upgrade means replacing the board or the whole laptop.
Which processors fit BGA 2114?
Arrow Lake-HX and HX Refresh processors such as the Core Ultra 200HX Plus series, at 55 W.
What memory does BGA 2114 use?
DDR5 SODIMM memory. Exact speeds and capacity follow the laptop design.
Sources and verification
- HX/HX Plus-Series Chip Package BGA Markings, Pin Count 2114 (Intel EDC)
- Intel Core Ultra 200HX Series Quick Reference Guide (Intel)
Facts last checked against these sources on . Page last edited on .