BGA 1296 socket: CPUs, chipsets and cooler fit
BGA 1296 is the Intel soldered package for Apollo Lake Atom edge SoCs. It carries 1,296 contacts in a 24 × 31 mm footprint and solders directly to the embedded board. Intel launched the E3900 series in the fourth quarter of 2016 at 6.5 W to 12 W with industrial temperature options.
Quick facts
| Maker | Intel |
|---|---|
| Package type | BGA |
| Contacts | 1,296 |
| Package size | 24 × 31 mm |
| Introduced | October 2016 |
| Status | Previous generation |
| Memory | DDR3L-1866 and LPDDR4-2133 ECC, four channels, up to 8 GB |
| PCIe from the CPU | PCIe 2.0, 6 lanes |
| Cooler mounting holes | Not applicable (soldered) |
| Replaces | None |
| Replaced by | None |
Overview
The package exists for edge servers and industrial PCs where ECC memory and 4K graphics must meet low power. Two or four Goldmont cores with HD 500 or 505 graphics cover gateway and signage loads. Memory spans DDR3L with ECC options and LPDDR4 over four channels to 8 GB. PCIe 2.0 with 6 lanes feeds NICs and storage beside SoC SATA and USB.
Because the die solders down there is no later swap. Embedded vendors validate boards for years of supply with extended temperature ranges. Buyers pick dual core E3930 for gateways or quad E3940 and E3950 for heavier edge work once.
Processor generations
| Codename | Marketing name | Years | Notes |
|---|---|---|---|
| Apollo Lake | Atom x5-E3900 and x7-E3950 series | 2016 | Goldmont edge SoCs with HD 500 and 505 graphics, launched in late 2016 for industrial designs with extended temperature options. |
Who BGA 1296 serves
BGA 1296 fits industrial gateways, digital signs and edge servers where 4K output with ECC must fit about 10 W. The 6.5 W dual core E3930 suits always on gateways, while the 9.5 W and 12 W quads cover storage and video nodes. Extended temperature options suit harsh installs.
Within the family the choice runs from the 2 core E3930 through the 4 core E3940 to the top E3950 with HD 505 graphics. Core count and graphics tier decide, since memory and I/O stay constant. Pick quads where edge VMs need threads.
Memory and PCIe
Memory support is DDR3L to 1866 MT/s with ECC and non-ECC options plus LPDDR4 to 2133 MT/s, over four channels to 8 GB with up to 34.1 GB/s. ECC DDR3L suits unattended edge data. Soldered LPDDR4 suits sealed boxes.
PCIe 2.0 with 6 lanes in x4, x2 and x1 splits serves NICs and NVMe alongside 2 SATA ports and 8 USB ports from the SoC. Compact flash arrays suit logging workloads. Check lane splits per board before adding cards.
CPUs on BGA 1296
3 processor pages in the database, newest first.
| Processor | Cores / threads | Base / boost | TDP | Launched |
|---|---|---|---|---|
| Intel Atom x5-E3930 | 2 / 2 | 1.3 / 1.8 GHz | 6.5 W | Oct 2016 |
| Intel Atom x5-E3940 | 4 / 4 | 1.6 / 1.8 GHz | 9.5 W | Oct 2016 |
| Intel Atom x7-E3950 | 4 / 4 | 1.6 / 2.0 GHz | 12 W | Oct 2016 |
Frequently asked questions
Can a BGA 1296 processor be replaced or upgraded?
No. The chip solders with 1,296 balls. A faster edge node means a new board. Memory and storage choices lock at order time on most embedded boards.
What memory does BGA 1296 use?
DDR3L up to 1866 MT/s and LPDDR4 up to 2133 MT/s over four channels up to 8 GB, with ECC options on DDR3L. ECC suits unattended edge operation.
How many PCIe lanes does BGA 1296 provide?
PCIe 2.0 with 6 lanes in x4, x2 and x1 splits. Edge boards wire lanes to NICs and NVMe storage. Two SATA ports and 8 USB ports come from the SoC beside PCIe.
What is the difference between BGA 1296 and BGA 1170?
BGA 1296 at 24 × 31 mm carries 6.5 W to 12 W Apollo Lake Goldmont SoCs with 4K graphics and ECC options. BGA 1170 at 25 × 27 mm carries older 22 nm Bay Trail-M Celeron parts without ECC.
Sources and verification
- Intel Atom x5-E3940 Processor specifications (Intel)
- Intel Atom x5-E3930 Processor specifications (Intel)
- Intel Atom x7-E3950 Processor specifications (Intel)
Facts last checked against these sources on . Page last edited on .