VIA CoreFusion Luke 533 socket: VIA BGA 368

The VIA CoreFusion Luke 533 uses the VIA BGA 368 socket. It is a 6 W single-core Nehemiah C5P part at 533 MHz with its CN400 northbridge and graphics in the same soldered module, launched in March 2005 for embedded boards.

Launched
March 2005
Cores and threads
1 and 1
Base power
6 W
Codename
Nehemiah C5P
Segment
Embedded
Clocks
0.53 GHz

VIA CoreFusion Luke 533 specifications

Cores1
Threads1
Core architectureNehemiah C5P
Clocks533 MHz, no turbo
Cache64 KB L2
Default TDP6 W
Manufacturing process130 nm (TSMC)
Memory supportDDR1, single channel, up to 400 MT/s (CN400)
Front side bus133 MHz
PCI ExpressNone from the processor; expansion through the board chipset
Integrated graphicsS3 UniChrome Pro (in the CN400 northbridge)
MultiplierLocked
PackageVIA BGA 368 (soldered)

Motherboard compatibility

VIA CoreFusion Luke 533 needs a motherboard with a VIA BGA 368 socket. Chipset by chipset data for this codename is not recorded yet. See the VIA BGA 368 chipset list and the board maker's CPU support list.

VIA BGA 368 at a glance

TypeBGA, 368 contacts
Package sizen/a
IntroducedMarch 2005
MemoryDDR1 in a single channel through the board chipset
Cooler mounting holesNot applicable (soldered)

Read the full VIA BGA 368 socket guide

What the CoreFusion Luke 533 is

The VIA CoreFusion Luke 533 is a 533 MHz single-core embedded processor from March 2005. It runs one Nehemiah C5P core at 533 MHz with no turbo, so 1 core gives 1 thread. Cache is 64 KB of L2 with 64 KB of L1 data and 64 KB of L1 instruction cache on a 130 nm process. Power is rated at 6 W in a soldered VIA BGA 368 module.

Luke pairs the Nehemiah core with the VIA CN400 northbridge and S3 UniChrome Pro graphics in one module, which separates it from Luke-Lite parts that use the CN333 northbridge for slower memory. The Luke range spans 533 MHz to 1000 MHz on a 133 MHz front side bus, with the 533 MHz bin as the entry point for fanless operation. VIA aimed the bin at always-on network appliances, point of sale terminals and kiosks on Mini-ITX boards where silent running matters more than speed. The core supports MMX, SSE and 3DNow with the VIA PadLock engine for AES encryption and random number generation and LongHaul power handling.

Soldered packaging defines the service model. The module arrives soldered to embedded Mini-ITX and Nano-ITX boards next to a VIA south bridge, so the board and processor share one service life. That is why buyers evaluate the whole device, not the chip alone, with memory slots, LAN ports and display outputs fixed by the board.

Socket and motherboard compatibility

The Luke 533 ships soldered on VIA BGA 368 embedded boards and cannot be removed or upgraded. There is no lever socket and no retail box; the board maker solders the module at the factory and the device ships complete. VIA EPIA Mini-ITX boards are typical carriers, pairing the module with DDR slots, a PCI slot, LAN and display outputs for kiosks and networked appliances. The Socket vs chipset: what decides whether a CPU works guide covers how socket and board pairing works in general.

Board choice fixes the platform. Memory type, slot count, expansion and display connections all live on the board, and no BIOS update changes the soldered processor. The module fits no socketed board and swaps with no other package. When a device outgrows 533 MHz, the replacement is a whole board with a faster Luke part, such as an 800 MHz or 1 GHz module, rather than a chip swap.

Memory, PCIe and cooling

Memory is DDR1 in a single channel through the integrated CN400 northbridge, at up to 400 MT/s on Luke boards. The board design sets the slot count and maximum capacity, with Luke-Lite CN333 boards limited to 333 MT/s as the one memory difference between the twins. The processor holds its controller inside the northbridge portion of the module.

No PCI Express lanes come from the processor. Board chipsets provide expansion such as the PCI slot on EPIA Mini-ITX boards, while graphics come from the integrated S3 UniChrome core with MPEG-2 and MPEG-4 decoding acceleration for media playback without a separate card. Cooling is the board maker heatsink for the exact chassis, and the 533 MHz bin runs fanless in small enclosures with its 6 W maximum and lower average draw near 4 W. The 70 C junction limit leaves room for silent cases.

Upgrade paths

On VIA BGA 368 there is no CPU upgrade path because the chip is soldered, so a faster device means replacing the whole board. Within the CoreFusion family, Luke boards at 800 MHz and 1 GHz offer more throughput for media work as board swaps. Luke-Lite boards at similar clocks trade DDR400 for DDR333 where cost matters. A move to later VIA Eden and C7 platforms needs a new board on a different soldered package with DDR2 support. For devices that must stay in service, identical spare boards are the practical path, since the processor cannot be refreshed alone.

Frequently asked questions

What socket does the CoreFusion Luke 533 use?

VIA BGA 368, soldered, so it cannot be removed or upgraded. The board carries the processor as one fixed module.

How does Luke differ from Luke-Lite?

The northbridge. Luke pairs the Nehemiah core with the CN400 for DDR400 memory, while Luke-Lite uses the CN333 for DDR333. Clocks, cache and power are otherwise in the same 533 MHz to 1000 MHz family.

When did the CoreFusion Luke 533 launch?

March 2005. The Luke platform launched on March 8, 2005, with the family spanning 533 MHz to 1000 MHz at 6 W to 10 W.

Can the Luke 533 be replaced with a faster chip?

No. The module is soldered, so there is no CPU upgrade path. A faster embedded board means replacing the whole device.

Sources and verification

  1. VIA CoreFusion (Wikipedia)
  2. VIA CoreFusion Luke-Lite 800 Specs (TechPowerUp)

Facts last checked against these sources on . Page last edited on .