Intel Xeon E7-8867 v3 socket: LGA 2011-1
The Intel Xeon E7-8867 v3 uses the LGA 2011-1 socket on Brickland 8S boards. It is a 16 core Haswell-EX part with 32 threads from 2.5 GHz to 3.3 GHz at 165 W.
- Socket
- LGA 2011-1
- Launched
- June 2015
- Cores and threads
- 16 and 32
- Base power
- 165 W
- Codename
- Haswell-EX
- Segment
- Server
- Family
- Intel Xeon E7
- Clocks
- 2.5 / 3.3 GHz
Intel Xeon E7-8867 v3 specifications
| Cores | 16 |
|---|---|
| Threads | 32 |
| Core architecture | Haswell cores on 22 nm |
| Clocks | 2.5 GHz base, up to 3.3 GHz turbo |
| Cache | 45 MB Last Level Cache |
| Processor base power (TDP) | 165 W |
| Manufacturing process | 22 nm |
| Memory support | DDR4 and DDR3 ECC, four channels, up to 1.5 TB per socket |
| PCI Express | PCIe 3.0, 32 lanes |
| Integrated graphics | None |
| ECC memory | Supported |
| Package | FCLGA2011 (52 × 45 mm) |
Motherboard and chipset compatibility
Intel Xeon E7-8867 v3 needs a motherboard with a LGA 2011-1 socket. The table shows which chipset series accept it.
| Series | Chipsets | Support |
|---|---|---|
| Brickland platform | C602J | Works out of the box Boards ship with E7 v3 support on Brickland. Check the system vendor matrix for BIOS and stepping. |
Board makers publish a CPU support list for every model. Check it for your exact board before buying. Chipset details for LGA 2011-1.
LGA 2011-1 at a glance
| Type | LGA, 2,011 contacts |
|---|---|
| Package size | 52 × 45 mm |
| Introduced | May 2015 |
| Memory | DDR4-1333 to 1866 and DDR3 with ECC, four channels, up to 1.5 TB per socket |
| Cooler mounting holes | Board specific (server heatsink) |
What the Xeon E7-8867 v3 is
The Xeon E7-8867 v3 is a high clock 16 core Haswell-EX part on LGA 2011-1 for latency sensitive 8S systems. Intel set 16 cores and 32 threads at 2.5 GHz base with turbo to 3.3 GHz. Forty five megabytes of last level cache feed queries. Power is 165 W on 22 nm from the second quarter of 2015.
High base clocks for 16 cores suit databases with per query latency goals. Three QPI links at 9.6 GT/s mesh eight sockets. The 165 W envelope needs top tier 8S cooling. Per core licenses favor fewer faster cores over more slower ones.
DDR4 and DDR3 ECC over four channels to 1.5 TB per socket feed big memory tenants. Buyers pick the 8867 v3 where 8S scale must still burst like smaller systems.
Socket and motherboard compatibility
The 8867 v3 fits LGA 2011-1 on Brickland 8S boards with high power budgets. Firmware must list the 165 W stepping. Power delivery differs from 115 W 4S boards, so check vendor power specs.
ECC memory is DDR3 or DDR4 per system. The Socket vs chipset: what decides whether a CPU works guide covers concepts, vendor 8S docs decide power and DIMM layouts.
Memory, PCIe and cooling
Memory to 1.5 TB per socket with ECC suits high clock 8S databases. DDR4 at 1866 preferred for bandwidth per core. Mirroring protects latency critical data.
PCIe 3.0 with 32 lanes per socket serves low latency fabrics. Query tails depend on interconnect and NUMA placement. Fast networking beats local SSD speed here.
Cooling uses 165 W 8S heatsinks with strong front to back airflow. No retail cooler exists. High clocks need cool inlets to sustain turbo.
Upgrade paths
On the same socket the Intel Xeon E7-8860 v3 at 2.2 GHz base below saves power for similar threads, while the Intel Xeon E7-8890 v3 at 18 cores adds density above. All share LGA 2011-1 where listed.
A v4 refresh needs new firmware. The 8867 v3 leads high clock 16 core 8S in Haswell-EX.
Frequently asked questions
What socket does the Intel Xeon E7-8867 v3 use?
It uses LGA 2011-1 on Brickland 8S boards.
How many cores does the Xeon E7-8867 v3 have?
16 cores and 32 threads at 2.5 GHz base with turbo to 3.3 GHz.
What is the TDP of the Xeon E7-8867 v3?
165 W.
When did the Xeon E7-8867 v3 launch?
June 2015.
Sources and verification
- Intel Xeon Processor E7-8867 v3 specifications (Intel)
- Intel Xeon E7 v3 Family Brief (Intel, SKU table)
Facts last checked against these sources on . Page last edited on .