Intel Xeon D-1712TR socket: BGA 2227

The Intel Xeon D-1712TR uses BGA 2227, a soldered BGA for Xeon D network processors with DDR4 ECC memory. The 4-core chip at 40 W needs a single socket network appliance board, and the soldered part cannot be replaced.

Socket
BGA 2227
Launched
February 2022
Cores and threads
4 and 8
Base power
40 W
Codename
Ice Lake-D
Segment
Server
Clocks
2.0 / 3.1 GHz

Intel Xeon D-1712TR specifications

Cores4
Threads8
Core architectureSunny Cove (Ice Lake-D)
Clocks2.0 GHz base, up to 3.1 GHz turbo
Cache10 MB Intel Smart Cache (L3)
Processor base power (TDP)40 W
Manufacturing process10 nm
Memory supportDDR4-2400, 3 channels, up to 384 GB, ECC supported
PCI ExpressPCIe Gen4 with 16 lanes from the SoC plus PCH Gen3 lanes
MultiplierLocked
PackageFCBGA2227 (45 × 45 mm, soldered)

Motherboard compatibility

Intel Xeon D-1712TR needs a motherboard with a BGA 2227 socket. Chipset by chipset data for this codename is not recorded yet. See the BGA 2227 chipset list and the board maker's CPU support list.

BGA 2227 at a glance

TypeBGA, 2,227 contacts
Package size45 × 45 mm
IntroducedFebruary 2022
MemoryDDR4 up to 2933 MT/s, 3 channels, up to 384 GB, ECC supported
Cooler mounting holesNot applicable (soldered)

Read the full BGA 2227 socket guide

What the Xeon D-1712TR is

Intel Xeon D-1712TR, launched in February 2022, brings 4 cores and 8 threads to BGA 2227 systems. Sunny Cove cores run 2.0 GHz base with up to 3.1 GHz turbo, backed by 10 MB of Intel Smart Cache. The 40 W rating sets board cooling and power delivery.

Memory support covers DDR4-2400, 3 channels, up to 384 GB, ECC supported. Three channels feed compact network functions and edge containers, and ECC corrects single-bit errors during continuous duty. Sixteen Gen4 lanes from the SoC serve NICs and NVMe on small boards. The Socket vs chipset: what decides whether a CPU works guide covers board wiring for edge systems.

The 1712TR suffix marks this chip for the network appliance range. Makers validate it on specific appliance boards, so the board CPU list names the exact suffix. Builders who need more cores on the same package use Intel Xeon D-1715TER, while fewer cores cut power for small edge nodes.

Socket and motherboard compatibility

The D-1712TR fits BGA 2227 on single socket network or edge boards with soldered retention. The chip is soldered and cannot be replaced. Board lists must name the exact suffix for qualification.

There is no multi-socket option and no socketed variant. Memory channels, NIC wiring and expansion follow the appliance design, not a retail motherboard list. Larger boards on BGA 2579 serve dense appliances, while BGA 2227 serves compact edge nodes.

Memory, PCIe and cooling

DDR4-2400, 3 channels, up to 384 GB, ECC supported. Matched DIMMs hold the rated speed across all populated channels.

PCIe Gen4 lanes from the SoC wire high-speed NICs and NVMe, 16 lanes for compact edge boards. PCH Gen3 lanes serve board devices behind them.

Cooling belongs to the appliance maker across the 40 W band with front-to-back airflow. No boxed cooler exists. Paste service follows the maker manual for the large soldered package.

Single socket platform

Every Xeon D in this stack runs single socket only with no interconnect links between processors. The Intel Xeon D-1712TR pairs 4 cores and 8 threads with 3 channels of DDR4 ECC memory on one board, so throughput scales with clocks and channels rather than with socket count. Appliance makers validate the exact suffix on their board and firmware before volume orders.

Sixteen Gen4 lanes from the SoC wire high-speed NICs and NVMe storage, with PCH Gen3 lanes behind them for board devices. The 40 W rating of this SKU decides heatsink size and airflow direction in the appliance chassis. Because the chip solders down, core count, memory size and TDP are chosen once at order time for the life of the box.

Upgrade paths

On BGA 2227 the moves run along core count within the same board class, up to flagships such as Intel Xeon D-1715TER where validated. Core growth needs no board change when the maker lists the part.

Beyond the series the replacement is a whole appliance on newer platforms. The LGA, PGA and BGA: CPU package types explained guide explains when a platform change pays off.

Frequently asked questions

What is the TDP of the Intel Xeon D-1712TR?

40 W processor base power, cooled by a vendor-qualified heatsink with front-to-back airflow.

Does the Intel Xeon D-1712TR have integrated graphics?

No. These network SoCs have no integrated graphics.

What socket does the Intel Xeon D-1712TR use?

It uses BGA 2227, a soldered BGA for Xeon D processors. The chip cannot be replaced.

How many cores does the Intel Xeon D-1712TR have?

4 cores with 8 threads: 2.0 GHz base and up to 3.1 GHz turbo, with 10 MB of cache.

What memory does the Intel Xeon D-1712TR support?

DDR4 ECC across 3 channels to 384 GB.

Does the Intel Xeon D-1712TR support multi-socket operation?

No. Single socket only with no interconnect links.

What boards fit the Intel Xeon D-1712tr?

Single socket network appliance boards validated for the exact suffix, with DDR4 ECC DIMMs and Gen4 NICs fitted to the workload.

Sources and verification

  1. Intel Intel Xeon D-1712TR specifications (Intel ARK)
  2. Intel Xeon D-1712TR specifications (TopCPU)

Facts last checked against these sources on . Page last edited on .