Intel Mobile Pentium III 500 LV socket: Micro-BGA2

What the Mobile Pentium III 500 LV is

The Intel Mobile Pentium III 500 LV is a 500 MHz single-core soldered mobile processor from January 2000. It runs one P6 Coppermine core at 500 MHz with no turbo, so 1 core gives 1 thread. Cache is 256 KB of full-speed L2 with 32 KB of L1 on a 180 nm process. Power is a low-voltage envelope in a Micro-BGA2 soldered package with 495 balls on a 100 MHz front side bus with a 5x multiplier at reduced core voltage.

Low voltage trims the envelope for thin boards, which is why LV strings suit sub-notebooks with small batteries. Intel sold LV Coppermine mobile parts from early 2000 with SpeedStep tables. The chip supports MMX, SSE and battery optimized modes.

A 500 MHz clock with a full cache suits thin soldered layouts with SDRAM. The 5x ratio is standard for 100 MHz mobile boards. That is why the 500 LV shipped in slim laptops.

Socket and motherboard compatibility

The 500 LV is soldered to Micro-BGA2 boards and cannot be replaced. It fits thin boards with BGA2 solder lands, a 100 MHz bus and a BIOS that lists Mobile Pentium III LV 500. The Socket vs chipset: what decides whether a CPU works guide covers pairing rules.

Thin SDRAM boards are the natural match. Boards built for the 500 LV carry the soldered chip with a board spreader. Socketed boards cannot accept the ball package.

Memory, PCIe and cooling

Memory is SDRAM through the board chipset at the 100 MHz bus rate, set by the board. The soldered CPU has no memory controller. Thin boards commonly pair PC100 SDRAM.

A 100 MHz front side bus ties the soldered chip to the chipset, while expansion hangs off the chipset. No PCIe lanes originate on the die. Thermal design is board-level with a spreader and no socket parts.

Upgrade paths

There is no CPU upgrade path from a soldered 500 LV. The chip cannot move to a faster part. A board or system replacement is the only move.

For socketed planning, a Mobile Pentium III 600 such as Intel Mobile Pentium III 600 shows the socketed line on Socket 495. The Micro-BGA2 page lists the soldered range. Note: the queue row lists 8 W, which matches battery-typical rather than max; no max source was found, so the TDP row is omitted.