Intel Core 9 273PQE socket: LGA 1700
The Intel Core 9 273PQE uses the LGA 1700 socket. It is the 125 W twelve core of the Bartlett Lake embedded range for industrial and edge systems, and consumer 600 and 700 series boards have no BIOS support for it, so it runs only on industrial boards that list it.
- Socket
- LGA 1700
- Launched
- March 2026
- Cores and threads
- 12 and 24
- Base power
- 125 W
- Codename
- Bartlett Lake
- Segment
- Embedded
- Family
- Intel Core 9
- Clocks
- 3.4 / 5.9 GHz
Intel Core 9 273PQE specifications
| Cores | 12 (12 Performance-cores, no Efficient-cores) |
|---|---|
| Threads | 24 |
| P-core clocks | 3.4 GHz base, up to 5.5 GHz turbo (up to 5.9 GHz Thermal Velocity Boost) |
| Cache | 36 MB Intel Smart Cache (L3) |
| Processor base power (TDP) | 125 W |
| Suffix meaning | PQE marks the 125 W embedded class (PE is 65 W, PTE is 45 W) |
| Manufacturing process | Intel 7 |
| Memory support | DDR5 up to 5600 MT/s or DDR4 up to 3200 MT/s, two channels, up to 192 GB |
| PCI Express | 20 lanes from the CPU: PCIe 5.0 x16 (or 2 x8) plus PCIe 4.0 x4 |
| Integrated graphics | Intel UHD Graphics 770 (32 execution units, 300 MHz to 1.65 GHz) |
| ECC memory | Yes |
| Package | FCLGA1700 (45.0 × 37.5 mm) |
| Launch price | $589 (Intel RCP, tray) |
Motherboard compatibility
Intel Core 9 273PQE needs a motherboard with a LGA 1700 socket. Chipset by chipset data for this codename is not recorded yet. See the LGA 1700 chipset list and the board maker's CPU support list.
LGA 1700 at a glance
| Type | LGA, 1,700 contacts |
|---|---|
| Package size | 45.0 × 37.5 mm |
| Introduced | November 2021 |
| Memory | DDR4 or DDR5, set by the motherboard (one type per board) |
| Cooler mounting holes | 78 × 78 mm |
What the Core 9 273PQE is
The Intel Core 9 273PQE leads the Bartlett Lake embedded family as its fastest twelve core, launched in the first quarter of 2026 under Core Series 2. Twelve Performance-cores with Hyper-Threading deliver 24 threads, 36 MB of Intel Smart Cache sits on the die, and no Efficient-cores are present. Base frequency is 3.4 GHz, Performance-cores reach 5.5 GHz, Turbo Boost Max 3.0 touches 5.7 GHz, and Thermal Velocity Boost peaks at 5.9 GHz. Intel fabricates the chip on Intel 7 with a 125 W base power and a $589 tray recommended customer price.
That 3.4 GHz base is the highest sustained starting point in the twelve core set, which matters more than the headline boost for saturated edge servers. Throughput jobs that pin every core for hours live near base and all core turbo rather than single core peaks, so the PQE class converts its power budget directly into completed work per rack unit. Intel also grants this SKU vPro Enterprise eligibility, which brings remote provisioning and hardware level management to large fleets.
Twelve identical high clock cores change the scheduling picture for real time networking code. There are no slow cores for the operating system to avoid and no hybrid aware scheduler required in the software image, which trims validation effort for vendors that certify fixed stacks. Time Coordinated Computing and Time Sensitive Networking support in the family, plus long term servicing contract Windows coverage, round out the long deployment story.
Socket and motherboard compatibility
Physically the part is FCLGA1700 for LGA 1700, but firmware draws the boundary. Only industrial boards that name Bartlett Lake in their support lists start the chip, typically W680 and Q670 class designs with R680E, Q670e, H610E and H610 options also documented for the family. A 125 W processor additionally demands a board whose voltage regulation is rated for continuous high current, so check power as well as the CPU list.
ASRock drew the consumer line explicitly: no Bartlett Lake support is planned across its retail LGA 1700 lineup including Z790, since it classes these processors as industrial parts for embedded PCs and similar installations. A retail board cannot learn the chip through any update, and an unrecognized processor stops the boot before memory training. Retail LGA 1700 ownership therefore tops out with the 14th Gen desktop stack.
Site planning starts with the board class. W680 class hardware pairs the 273PQE with ECC memory for unattended edge points of presence, while Q670 class hardware aims at administered fleets. The Socket vs chipset: what decides whether a CPU works guide explains why chipset series and BIOS level must both line up before a processor runs.
Memory, PCIe and cooling
The memory controller handles DDR5 up to 5600 MT/s or DDR4 up to 3200 MT/s across two channels to 192 GB, with ECC supported for data sensitive roles. DDR5 suits new high throughput builds, while DDR4 boards let operators extend memory bought for earlier industrial generations. Board choice fixes the slot type permanently, so memory and board ship as one decision.
For I/O the chip provides 20 direct lanes, sixteen PCIe 5.0 for accelerators or multi hundred gigabit networking plus four PCIe 4.0 for NVMe, with eight DMI 4 lanes feeding the chipset fabric. Intel UHD Graphics 770 contributes 32 execution units at 300 MHz to 1.65 GHz for as many as four displays, so status walls and operator stations run from the processor itself.
A 125 W base power rating sets serious cooling demands for an embedded envelope. Specify a heatsink and airflow path rated for continuous full load at the worst case cabinet temperature, remembering that tray parts include no cooler. Mounting follows the 78 mm LGA 1700 pattern detailed in the CPU cooler compatibility by socket guide, shared with the LGA 1851 successor.
Upgrade paths
The in family path stays inside Bartlett Lake on the same industrial board. Dropping from the 273PQE to the 65 W 273PE or the 45 W 273PTE trims heat and running cost where twelve threads already cover the load, while ten and eight core siblings cut further. Any such move still needs the destination SKU on the board support list with cooling to match.
No migration connects this line with retail desktop silicon. The Intel Core i5-14400 exemplifies the other side: a Raptor Lake Refresh desktop part for consumer 600 and 700 series boards, on firmware the 273PQE cannot use and vice versa. Shared socket dimensions do not create a shared platform.
Beyond LGA 1700 industrial hardware, renewal means a newer embedded platform with board, memory and validation chosen together, using the How to find your CPU socket type guide to confirm the package. Given long industrial supply windows, many 273PQE systems will serve their full term before that question arises.
Frequently asked questions
What socket does the Intel Core 9 273PQE use?
It uses LGA 1700, marked FCLGA1700 in Intel documents. Only industrial boards with firmware support start with it.
Can I drop the 273PQE into my Z790 board for twelve fast cores?
No. ASRock confirmed its consumer LGA 1700 boards, Z790 included, will not receive Bartlett Lake BIOS support. The chip fits the socket physically but the board will not start without the matching firmware.
Does the 273PQE support vPro management?
Yes, Intel lists vPro Enterprise eligibility for the 273PQE, which enables remote provisioning and hardware level fleet management on supporting industrial boards.
What cooling does the 273PQE need?
A 125 W sustained load needs an industrial heatsink and cabinet airflow rated for continuous full load. No cooler ships in the tray, so thermal design belongs to the system builder.
Sources and verification
- Intel Core 9 processor 273PQE specifications (Intel)
- Intel keeps socket LGA 1700 alive with new P-core-only Bartlett Lake CPUs (Tom's Hardware)
- Bartlett Lake, Intel's P-Core Only CPUs: Models and Specs (HWCooling)
- Bartlett Lake: not for gamers! (Overclocking.com)
Facts last checked against these sources on . Page last edited on .