Intel Atom C5335C1 socket: BGA 2106

What the Atom C5335C1 is

Intel positions the Atom C5335C1 as the 12-core member of the Atom C5000 Parker Ridge family for BGA 2106 boards from 2022. 12 Tremont cores without Hyper-Threading give 12 cores and 12 threads at a fixed 2.4 GHz with no boost table. The package carries 13.5 MB of cache. The 50 W envelope fits compact appliance heatsinks.

DDR4-2933, 2 channels, ECC, up to 256 GB with ECC feed the cores for forwarding tables, and matched DIMMs hold the rated speed. PCIe Gen3 lanes wire NICs and NVMe on the appliance board. Fixed clocks keep validation simple across temperature ranges.

Mid range network appliances take this 12-core C part at 50 W, where thread count grows without the P-series power class. Boards need a BGA 2106 layout with the Atom C5335C1 qualified at design time, since the chip solders to the board. The Socket vs chipset: what decides whether a CPU works guide covers embedded board choice in general, and Intel Atom C5315 shows a nearby BGA 2106 option.

Socket and motherboard compatibility

The C5335C1 solders to BGA 2106 with 2106 balls and cannot be replaced. There is no socket upgrade path, so buyers choose the SKU at board layout time. The footprint is shared across Snow Ridge and Parker Ridge, but lane wiring follows the SKU lane count.

Platform choice decides port count and switching rather than CPU fit. A board built for a 12-lane C part cannot use all 32 lanes of a P part even though both share the grid array. Check the board design files for the exact SKU before spinning the layout.

Memory, PCIe and cooling

DDR4-2933, 2 channels, ECC, up to 256 GB feed the cores, and matched DIMMs hold the rated speed. Capacity reaches 256 GB with high density DIMMs, which suits tables and buffers on 12 cores.

PCIe Gen3, 16 lanes wire NICs, NVMe and storage controllers on the appliance board. Lane bifurcation follows board firmware, so slot population rules come from the board manual.

The 50 W envelope needs a board heatsink with appliance airflow. The 47.5 × 47.5 mm package uses factory reflow with even mounting pressure. Paste and torque sequence follow the board maker specification.

Upgrade paths

On BGA 2106 there is no CPU upgrade path because the chip is soldered. The practical moves are memory growth within the 256 GB ceiling and NIC additions where lanes allow, or a new board spin for a larger SKU.

Outside this SKU, Intel Atom C5315 (Atom C5315) on BGA 2106 trims or adds cores for lighter or denser templates. A move to socketed Xeon scale needs a new board with its own memory plan, so board local growth comes first.