AMD Z-01 socket: Socket FT1
The AMD Z-01 uses the Socket FT1 package. It is a soldered 6 W dual core Desna APU at 1.0 GHz for early tablets.
- Socket
- Socket FT1
- Launched
- June 2011
- Cores and threads
- 2 and 2
- Default TDP
- 6 W
- Codename
- Desna
- Segment
- Mobile (soldered)
- Family
- AMD Z
- Clocks
- 1.0 GHz
AMD Z-01 specifications
| Cores | 2 |
|---|---|
| Threads | 2 |
| Core architecture | Bobcat cores on 40 nm |
| Clocks | 1.0 GHz (no turbo) |
| Cache | 1 MB L2 (512 KB per core) |
| Default TDP | 6 W |
| Manufacturing process | 40 nm |
| Memory support | DDR3-1066, single channel |
| PCI Express | PCIe 2.0 lanes from the APU |
| Integrated graphics | AMD Radeon HD 6250 (276 MHz) |
| Multiplier | Locked |
| Package | Socket FT1 (BGA, 413 balls, soldered) |
Motherboard compatibility
AMD Z-01 needs a motherboard with a Socket FT1 socket. Chipset by chipset data for this codename is not recorded yet. See the Socket FT1 chipset list and the board maker's CPU support list.
Socket FT1 at a glance
| Type | BGA, 413 contacts |
|---|---|
| Package size | n/a |
| Introduced | January 2011 |
| Memory | DDR3-1066, single 64-bit channel |
| Cooler mounting holes | Not applicable (soldered) |
What the Z-01 is
AMD Z-01 is a dual core Desna APU that AMD released in June 2011 for early tablets with soldered boards. It uses the Bobcat core design on a 40 nm process, running at 1.0 GHz with no turbo. The cache is 1 MB of L2 with 512 KB per core. Power is 6 W on TechPowerUp, matching the 5.9 W nominal figure AMD published for this cherry picked Ontario bin. Graphics come from AMD Radeon HD 6250 with 80 shaders at 276 MHz.
Desna is a low voltage Ontario bin for tablets rather than a new design, which is why clocks and graphics match the C-50 while power drops by a third. The single die integrates cores, graphics and the single channel DDR3 controller for thin fanless or small fan bodies. No turbo exists, so behavior stays fixed at 1.0 GHz.
At 6 W the Z-01 belongs to the early tablet group that preceded the 4.5 W Hondo parts. Boards pair it with soldered DDR3 and flash storage. The LGA, PGA and BGA: CPU package types explained guide explains why this soldered BGA part cannot be serviced.
Socket and motherboard compatibility
The Z-01 solders to Socket FT1 with 413 balls and cannot be moved to another board. Tablet makers qualify each model with a fixed board and BIOS, so another Bobcat part is not a field swap. Boards use thin tablet layouts with soldered memory and storage.
The BIOS must list the exact Z-01 string. Power at 6 W allows fanless designs with a spreader. The CPU cooler compatibility by socket guide notes soldered parts have no desktop mount.
Memory, PCIe and cooling
Memory support is DDR3-1066, single channel. Tablet boards solder the RAM, so size locks at purchase, commonly 1 GB to 2 GB. The single channel feeds cores and graphics together.
PCI Express lanes come from the APU for Wi-Fi and storage. Tablets have no expansion slots to consider.
Cooling uses a spreader sized for 6 W, often fanless. Fixed clocks need little airflow, but heat soak still slows sustained loads in sealed bodies.
Upgrade paths
There is no CPU upgrade path on soldered Socket FT1. The Z-01 cannot be removed, so a faster tablet means a new device. A later tablet comparison on the same package is AMD Z-60, though tablet boards never exchange models.
A platform move means a new tablet on a current mobile package. Recycle the old device through a proper e waste path once data is wiped.
Frequently asked questions
What socket does the AMD Z-01 use?
It uses Socket FT1, a soldered BGA package with 413 balls.
Is the Z-01 5.9 W or 6 W?
Both. AMD nominal is 5.9 W, rounded to 6 W in database listings.
What memory does the Z-01 use?
DDR3-1066, single channel, soldered on tablet boards.
Can the Z-01 be upgraded?
No. The APU is soldered to the board.
Sources and verification
Facts last checked against these sources on . Page last edited on .