AMD Ryzen 3 PRO 5475U socket: FP6

What the Ryzen 3 PRO 5475U is

The AMD Ryzen 3 PRO 5475U is the 4-core Barcelo APU for FP6 designs from April 2022. 4 cores with simultaneous multithreading give 4 cores and 8 threads, with base at 2.7 GHz and up to 4.1 GHz boost. The die carries 2 MB of L2 plus 8 MB of L3. The 15 W envelope fits fan cooled compact designs, and the integrated graphics drive displays without a discrete card.

AMD lists the part under the Barcelo codename, the 2022 refresh of the Cezanne silicon, which is why some tables print Cezanne-U for the same chip. Business fleets take this PRO part with manageability features for managed laptops, where the 15 W envelope fits thin corporate designs.

Business fleets take this PRO part with manageability features for managed laptops, where the 15 W envelope fits thin corporate designs. The Socket vs chipset: what decides whether a CPU works guide covers board choice for soldered designs in general, and AMD Ryzen 3 5425C shows a nearby option with a nearby core count.

Socket and motherboard compatibility

The 5475U is soldered to FP6 boards and cannot be replaced. There is no socket upgrade path, so buyers choose the core count and memory size at purchase. Boards must list the exact Ryzen 3 PRO 5475U in firmware support.

Chipset functions sit in the APU itself on FP6 designs, so board choice decides ports, display outputs and power delivery rather than CPU fit. Check the system maker manual before assuming any cross compatibility.

Memory, PCIe and cooling

DDR4-3200 and LPDDR4x-4267, dual channel, up to 64 GB feed the cores and the integrated graphics together, since the graphics share system memory. Population with matched modules holds the rated speed.

PCIe Gen3, 16 lanes from the CPU wire storage and radios on most boards. The Radeon Vega 6 covers office work, video playback and light creation without a discrete card.

Cooling is a 15 W thermal design with a shared heat pipe for the APU. There is no retail mounting pattern, so service parts follow the system maker manual. Sustained clocks depend on chassis cooling and the configured power window.

Upgrade paths

There is no CPU upgrade path on FP6 because the chip is soldered. The practical upgrades are larger storage, more system memory where slots exist, and a newer system when the platform ages.

Outside this APU, AMD Ryzen 3 5425C (Ryzen 3 5425C) on FP6 adds or trims cores for lighter or denser work. A move to a socketed desktop needs a new board with its own memory, so system replacement rather than CPU replacement is the path.